18.11.2012 Views

Technology Today 2007 Issue 1 - Raytheon

Technology Today 2007 Issue 1 - Raytheon

Technology Today 2007 Issue 1 - Raytheon

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

additional biometric acquisition devices,<br />

extra data storage space and complex software<br />

system development. It can also have<br />

a detrimental impact on the capture speed<br />

and system performance. The challenge of<br />

designing a biometrics fusion system is to<br />

balance desired accuracy while achieving<br />

high system performance.<br />

As a Mission System Integrator, <strong>Raytheon</strong> is<br />

working with several customers to design<br />

and develop mission-critical biometric systems.<br />

For example, <strong>Raytheon</strong> is working on<br />

the design and implementation of a multiinstance<br />

and multi-algorithmic fingerprint<br />

fusion system for verification and identification<br />

by fusing up to 10 fingerprints. Scorelevel<br />

fusion, which can potentially increase<br />

accuracy up several-fold depending on<br />

performance needs, can be used. This<br />

approach has been validated by National<br />

Institute Standard and <strong>Technology</strong> studies.<br />

<strong>Raytheon</strong> is also working to explore options<br />

to improve facial image capture quality.<br />

This will enable future multi-modal fusion<br />

applications to combine fingerprint and<br />

face biometrics to achieve improved system<br />

performance. In addition, <strong>Raytheon</strong> has<br />

provided design solutions to customers<br />

using multiple biometrics, including face,<br />

finger and iris, to work with very large<br />

galleries of low-quality data and with<br />

challenging response time requirements.<br />

As an industry leader in biometrics system<br />

integration, <strong>Raytheon</strong> is also investing<br />

internal corporate funds to develop system<br />

options with fusion technology. <strong>Raytheon</strong><br />

has partnered with other industry leaders in<br />

biometric technology and identity management,<br />

including L1, Motorola, ImageWare,<br />

Daon, Cross Match, NEC, Cogent, SAGEM<br />

Morpho and many other biometrics vendors.<br />

<strong>Raytheon</strong> is poised to provide solutions using<br />

multi-biometrics fusion technology for the<br />

criminal justice, border control and management,<br />

and intelligence and defense communities<br />

in order to protect our nation. •<br />

Charles Y Li<br />

charles_li@raytheon.com<br />

Skip Linehan<br />

skip_linehan@raytheon.com<br />

on<strong>Technology</strong><br />

<strong>Raytheon</strong> SAS Advanced<br />

Product Center’s<br />

Microwave Automated Factories<br />

Space and Airborne System’s (SAS)<br />

Advanced Product Center’s (APC)<br />

Microwave Automated Factory (MAF),<br />

located in Dallas, is the most highly automated<br />

facility for the production of defense<br />

and aerospace (including space) microwave<br />

products in the world. It offers a unique<br />

combination of high-volume, high-mix production<br />

and state-of-the-art prototyping<br />

and product development. The recent<br />

history of the MAF and its capabilities to<br />

support both production and development<br />

are as follows.<br />

History<br />

The facility has produced over one million<br />

complex microwave modules since its inception<br />

in 1993, with production rates exceeding<br />

20,000 modules per month. It has also<br />

produced over 45,000 next-higher-level<br />

transmit/receive integrated microwave module<br />

type assemblies (TRIMMs), or “slats.”<br />

Assembly complexity has ranged from hermetic<br />

modules with 20 components and<br />

100 wires to assemblies containing over<br />

100 devices and 350 wires. The most complex<br />

non-hermetic RF assembly produced to<br />

date contained 1,024 channels, approximately<br />

7,400 die and 16,000 wires — all<br />

designed, assembled and tested in the<br />

factory within seven months.<br />

Philosophy of Execution<br />

The most prevalent philosophy of execution<br />

is concurrent engineering with integrated<br />

product teams using IPDS. Early engagement<br />

of APC product engineers ensures<br />

that both the program and factory arrive<br />

with a winning solution for <strong>Raytheon</strong><br />

customers. This is coupled with a heavy<br />

emphasis on design-to-cost manufacturing<br />

using cutting-edge automated assembly<br />

and tests to produce the most consistent<br />

assemblies with minimal tuning and<br />

maximum yield.<br />

Y E S T E R D A Y … T O D A Y … T O M O R R O W<br />

R F S Y S T E M S<br />

Detailed design guidelines and producibility<br />

reviews ensure low cost, high yields and<br />

high reliability for all products produced in<br />

the facility. The factory’s focus on continuous<br />

improvement is fueled by a team-based<br />

operation with joint responsibility from both<br />

Operations and Engineering for program and<br />

factory performance. More than 85 percent<br />

of factory personnel and engineer team<br />

members are <strong>Raytheon</strong> Six Sigma certified.<br />

APC’s excellence in quality and technology<br />

has been recognized by awards at the SAS<br />

and corporate levels in 2004 and 2005.<br />

Key Statistics<br />

The MAF is a certified ISO 9001 facility containing<br />

both design and fabrication capabilities.<br />

Production is housed in a 25,000 sq.<br />

ft., Class 100K clean room and a 8,500 sq.<br />

ft. clean area. The production areas are<br />

complimented by a 900 sq. ft. process/<br />

product development area, a 570 sq. ft.<br />

prototyping area and a 570 sq. ft. process<br />

support lab.<br />

Production takes place on nine fully automated<br />

assembly lines and test stations. The<br />

assembly lines produce conventional upright<br />

chip-and-wire and flip-chip assembly using<br />

the industry’s most current equipment.<br />

Automated processes include component<br />

attach, wire/ribbon interconnects, hermetic<br />

sealing, inspection, conformal coating systems<br />

and symbolization. Statistical process<br />

control is maintained over all processes with<br />

current process capabilities ranging from<br />

4.5–6 sigma. A paperless computer-based<br />

manufacturing control system is used for<br />

statistical process monitoring, labor entry,<br />

graphically aided work instructions and<br />

assembly travelers. It is also used for realtime<br />

control and reporting of throughput,<br />

yields and process control parameters. Part<br />

pedigree is maintained through bar code<br />

Continued on page 26<br />

RAYTHEON TECHNOLOGY TODAY <strong>2007</strong> ISSUE 1 25

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!