ARTES-5.1 – ESA Telecom Technology Workplan ... - Emits - ESA

Annex 2Page 41Ref. Activity Title Procurement Policy Budget(KEUR)5C.103(09.153.13)Objective:Description:Planned TenderIssueReduced Footprint SSPA for telecom payloads Open Competitive Tender Type: C 600 Priority 2 18Estimated Duration(months)The objective of this activity is to manufacture and test an EM of a SSPA with a vertically mounted structure offering a significantly reduced footprint (reduced by >50%) compared to today’shorizontally mounted designs. The aim is to improve the layouts of the payload by enabling a higher density of equipment offering reduced cable lengths and therefore reduced losses.In Telecom satellites for mobile applications, SSPAs are used in the payload. However, due to the high number of SSPAs and the use of the largest side for mounting onto the satellite panels,the payload occupies a large area forcing the use of long RF cables generating high losses (up to 3dB). This can be improved significantly by SSPAs with smaller footprint. The solution existsto reduce significantly the SSPA footprint and it is even proposed by some overseas SSPA suppliers (e.g. Japan). The objective of this activity is to demonstrate the feasibility of verticallymounted SSPA where the RF power modules and drivers are kept close to the bottom of the equipment and therefore close to the heat pipes in the satellite panels. Various solutions can beinvestigated ranging from a simple flip of the whole equipment to a redistribution of the RF modules, and in particular the power and driver modules kept flat mounted and the low power RFsection and EPC mounted vertically. Additionally to this, the activity shall investigate in depth the application of new high performance materials providing improved heat conductivity inimprove the thermal management of such units. New materials (e.g. metal matrix materials) shall be considered for the SSPA structure (instead of standard aluminium) but also for the RFpower modules, while keeping the low weight of the unit. The objective is a footprint reduction >50% with no mass impact or even a mass reduction. The output power target is 20 to 30Wmulticarrier in L or S band for 15dB Noise Power Ratio. The activity aims at developing an EM SSPA structure populated with representative output and driver RF section and withrepresentative components for the EPC (DC/DC converter). As the whole structure would be re-designed with new materials and the internal layout of the equipment may be significantlyaffected, mechanical validation tests (e.g. vibration) and thermal validation tests will be included. The optimization of the thermal management of the overall equipment and of the RFtransition from vertical to the horizontal plane will be carefully studied. Finally the overall footprint might be compatible with a typical Ku (Ka) TWT (i.e. TWTA without EPC). This mayhave the further advantage to allow a standard heat pipe configuration for different types of payloads limiting the engineering costs and improving the level of standardization for payloadlayout and components.NOTE: This activity has been designated as "Priority 2". Priority 2 activities will only be initiated on the explicit request of at least one delegation.