Hitachi Chemical Metal CMP Slurry and Low-K Material

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Delaminationdelamination

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Delaminationdelamination

Why delamination happens ?1 Low mechanical strength of Low k material2 Poor adhesion between Low k and CVD3 High down force Cu polishing321PadCVDLow kSlurryCuBarrier Metal

Page 4: Hitachi Chemical Cu / Low-kIntegrat
Page 7: Advantages of AFPItem Conventional
Page 11 and 12: Concepts of HSG-7000HSG-7000RSi OnR
Page 13: Cu-CMP Process— Combination of HS

Hitachi Chemical Metal CMP Slurry and Low-K Material

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