Hitachi Chemical Metal CMP Slurry and Low-K Material

11.07.2015 • Views

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Hitachi Chemical Metal CMP Slurry and Low-K Material

Hitachi Chemical Metal CMP Slurry and Low-K Material

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<strong>Hitachi</strong> <strong>Chemical</strong> Cu / <strong>Low</strong>-kIntegration Process SolutionCu-<strong>CMP</strong> slurry• <strong>Low</strong> down forcepolishing<strong>Low</strong>-k material• High mechanicalstrength

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<strong>Hitachi</strong> <strong>Chemical</strong> Cu / <strong>Low</strong>-kIntegration Process SolutionCu-<strong>CMP</strong> slurry• <strong>Low</strong> down forcepolishing<strong>Low</strong>-k material• High mechanicalstrength

Page 2 and 3: Delaminationdelamination
Page 6 and 7: Polishing ModelDown ForceDown Force
Page 10 and 11: Young's modulus (GPa)8765Influence
Page 12 and 13: Film Properties of HSG series 1)Pro