Hitachi Chemical Metal CMP Slurry and Low-K Material

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Polishing ModelDown ForceDown ForcePadReaction layerAbrasivePadCuO(Cu2O)CuCuAbrasive FreePolishing pad shear forceConventionalAbrasive powder

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Polishing ModelDown ForceDown ForcePadReaction layerAbrasivePadCuO(Cu2O)CuCuAbrasive FreePolishing pad shear forceConventionalAbrasive powder

Advantages of AFPItem Conventional Abrasive Free MeritMicroScratchParticleResidueSiO Loss 2DishingErosionIncreasein YieldIncrease inReliabilityDesignedResistivityDesignedResistivityDesignedResistivity

Page 2 and 3: Delaminationdelamination
Page 4: Hitachi Chemical Cu / Low-kIntegrat
Page 11 and 12: Concepts of HSG-7000HSG-7000RSi OnR
Page 13: Cu-CMP Process— Combination of HS

Hitachi Chemical Metal CMP Slurry and Low-K Material

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