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Micro MATE-N-LOK Connectors - Logic IO

Micro MATE-N-LOK Connectors - Logic IO

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<strong>Micro</strong> <strong>MATE</strong>–N–<strong>LOK</strong> <strong>Connectors</strong>114–13000CAUT<strong>IO</strong>NDANGERNOTEEven when using “no clean” solder paste, it is imperative that the contact interface be kept clean of flux and residue,since it acts as an insulator. Flux may migrate under certain conditions with elevated temperatures and, therefore,cleaning is necessary.Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.Refer to the manufacturer’s Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners. It is notrecommended using Trichloroethylene and Methylene Chloride because of harmful occupational and environmentaleffects. Both are carcinogenic (cancer–causing).If you have a particular solvent that is not listed, contact the Product Information Center at the number at the bottom ofpage 1.NAMECLEANERTYPETIME(Minutes)TEMPERATURES(Maximum)CELSIUSFAHRENHEITAlpha 2110 Aqueous 1 132 270Bioact EC–7 Solvent 5 100 212Butyl Carbitol Solvent 1 Room AmbientIsopropyl Alcohol Solvent 5 100 212Kester 5778 Aqueous 5 100 212Kester 5779 Aqueous 5 100 212Loncoterge 520 Aqueous 5 100 212Loncoterge 530 Aqueous 5 100 212Terpene Solvent Solvent 5 100 212 Product of Fry’s Metals, Inc. Product of Petroferm, Inc. Product of Union Carbide Corp. Product of Litton Systems, Inc.Figure 15J. DryingWhen drying cleaned assemblies, make certain that temperature limitations are not exceeded: –40 to105 C [–68 to 221 F]. Excessive temperatures may cause housing degradation or plating deterioration.3.12. Checking Installed ConnectorAll solder joints should conform to the requirements specified in this document and those specified in thefollowing: Workmanship Specification 101–21 for surface mount connectorsTest Specification 109–11 for through hole mount connectorsSolder must be evenly distributed and not cracked. The connector standoffs must be seated on the pc board,and the housing not exceeding the dimension shown in Figure 16.Surface MountPin Header ConnectorThrough Hole MountPin Header Connector0.13 (Max)Standoff(4 Places)Solder JointPC BoardPC BoardStandoff(2 Places)Solder Joint0.13 (Max)Figure 1614 of 18Rev A

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