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Computation of Stress Intensity Factor in Functionally Graded Plates ...

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Strojniški vestnik - Journal <strong>of</strong> Mechanical Eng<strong>in</strong>eer<strong>in</strong>g 57(2011)7-8, 622-632p = 0.2 for other material properties. Figs. 9 and10 present the effect <strong>of</strong> variation <strong>in</strong> FGP elasticproperties, i.e. Young’s modulus and Poisson’sratio, on the SIF for the crack length a/W = 0.3and the plane stra<strong>in</strong> problem. Accord<strong>in</strong>g to Fig.9, the magnitude <strong>of</strong> SIF, especially its peak value,<strong>in</strong>creases significantly as the parameter p E is<strong>in</strong>creased. These results <strong>in</strong>dicate that for all values<strong>of</strong> p E , the peak and the crack closure time occurroughly simultaneously. This can be expla<strong>in</strong>ed bythe fact that the transient temperature distributionis <strong>in</strong>dependent <strong>of</strong> the variations <strong>of</strong> the parameterp E . We believe that the effect <strong>of</strong> Young’s modulusis responsible for the slight difference between thepeak time and the steady time.The <strong>in</strong>fluence <strong>of</strong> Poisson’s ratio gradationon the SIF is shown <strong>in</strong> Fig. 10. It can be seen that,by a decrease <strong>in</strong> p ν , i.e. for metal-riched whosegreater Poisson’s ratio, the magnitude <strong>of</strong> SIF andthe crack closure time <strong>in</strong>crease.The analytical solutions for thermal stressdistribution <strong>in</strong> an uncracked FGP under onedimensionaltemperature distribution for the planestra<strong>in</strong> and plane stress cases are given as [4]:σthxx 2 2andσEx ( 1)= ( Cx C α x ν T x t2 1 1+ 2 − ( 1)( 1+) ∆ ( 1, ), ) (21a)1 − ν( )thxx 2 2 1 1 1 2 1 1= Ex ( ) Cx + C −α( x ) ∆ T( x , t),(21b)The effects <strong>of</strong> the gradation <strong>of</strong> the thermalproperties on the SIF dur<strong>in</strong>g the shock period areshown <strong>in</strong> Figs. 11, 12 and 13. Fig. 11 depicts thenormalized SIF versus normalized time for variousvalues <strong>of</strong> the exponent p for the thermal expansioncoefficient, i.e., p α . Accord<strong>in</strong>g to this figure, thepeak value <strong>of</strong> SIF for the case p = 0.2 is significantlygreater than others. Also, depend<strong>in</strong>g on the p αvalue, the trend <strong>of</strong> SIF might be completelydifferent. For example, the crack is closed for thep α = 0.2 and p α = 1 cases, while the SIF for p α = 5<strong>in</strong>creases gradually to a steady-state value after itpeaks and reduces to a local m<strong>in</strong>imum.Fig. 10. Normalized K I versus normalized timefor different p ν ; plane stra<strong>in</strong> with a/W = 0.3,p = 0.2 for other material propertiesrespectively, where C 1 and C 2 are unknowncoefficients determ<strong>in</strong>ed from the force and momentboundary conditions <strong>in</strong> the x 2 direction. From Eq.(21), it is observed that the thermal stresses are an<strong>in</strong>creas<strong>in</strong>g function <strong>of</strong> Young’s modulus.Fig. 11. Normalized K I versus normalized timefor different p α values; plane stra<strong>in</strong> witha/W = 0.3, p = 0.2 for other material propertiesFig. 9. Normalized K I versus normalized time fordifferent p E ; plane stra<strong>in</strong> with a/W = 0.3, p = 0.2for other material propertiesFig. 12 illustrates the SIF variation <strong>in</strong>terms <strong>of</strong> time for various values <strong>of</strong> conductivityparameter p k . It can be seen that an <strong>in</strong>crease <strong>of</strong> theparameter p k causes a delay <strong>in</strong> the occurrence <strong>of</strong>the peak value <strong>of</strong> SIF and steady-state. This delayis not surpris<strong>in</strong>g s<strong>in</strong>ce the diffusivity k/ρc is an<strong>in</strong>creas<strong>in</strong>g function <strong>of</strong> the conductivity and thep k = 0.2 correspond to metal-riched composition<strong>Computation</strong> <strong>of</strong> <strong>Stress</strong> <strong>Intensity</strong> <strong>Factor</strong> <strong>in</strong> <strong>Functionally</strong> <strong>Graded</strong> <strong>Plates</strong> under Thermal Shock629

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