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InGaAs for infrared photodetectors. Physics and technology

InGaAs for infrared photodetectors. Physics and technology

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Contributed paperFig. 15. Schematic cross-section of <strong>InGaAs</strong>-InAlAs SAM APD device (after Ref. 14).structure is shown in Fig. 15. Starting from a semi-insulatingInP substrate, the bottom mirror, which consistedof 30 l/4 pairs of n + -In 0.53 Ga 0.47 As/In 0.52 Al 0.48 As, wasgrown by MBE. After the growth of the thin undopedIn 0.52 Al 0.48 As multiplication region, a p-type In 0.52 Al 0.48 Ascharge layer was inserted to ensure that the electric field inthe adjacent absorption region would be < 1×10 5 V/cm.This was followed by the 60 nm-thick In 0.53 Ga 0.47 As absorptionlayer. Finally, an undoped In 0.52 Al 0.48 As spacer<strong>and</strong> a p + -In 0.52 Al 0.48 As top layer were grown. To fabricate ahigh-speed device, first a Ti-Pt-Au contact metal ring wasdeposited <strong>and</strong> a mesa with the diameter of 14 µm was<strong>for</strong>med by chemical etching.Due to the resonant-cavity scheme, these APDs operatingat 1.55 µm exhibited high external quantum efficiency70% <strong>and</strong> a high unity-gain b<strong>and</strong>width of 24 GHz. Utilizingthe excellent noise characteristics of a thin InAlAs multiplicationregion, a record value of a gain-b<strong>and</strong>width productof 290 GHz was achieved.layer as the active medium. The thickness of the spacer layerswere chosen so that the three absorbing layers are locatedat the antinodes of the st<strong>and</strong>ing wave optical field inthe cavity [Fig. 16(b)]. The investigated devices, shownschematically in Fig. 17(a), were grown by MBE onn + -GaAs substrate. Thirteen period AlAs/GaAs quarter-wavestacks <strong>for</strong>med bottom mirror with the reflectivityabout 90% at the centre wavelength 900 nm. The threeIn 0.05 Ga 0.95 As active layers with each layer of the thickness40 nm were s<strong>and</strong>witched between GaAs layers. The topmirror with 30% reflectivity was <strong>for</strong>med by air <strong>and</strong> semiconductorinterface.The peak quantum efficiency of the triple-layer resonant--periodic-absorber photodiode was 65% [see Fig. 17(b)]. An enhancementof 30% has been achieved by a periodic absorberstructure as compared to a st<strong>and</strong>ard RCE photodiode with asingle absorbing layer of the same total thickness.3.2.3. RCE p-i-n PDThe first RCE p-i-n was reported by Dentai et al. who studiedan <strong>InGaAs</strong>/<strong>InGaAs</strong>P/InP structure designed to operatenear 1.55 µm [15]. A quantum efficiency of 82% wasachieved using a 200 <strong>InGaAs</strong> absorbing layer with R 1 =0.7 <strong>and</strong> R 2 = 0.95.RCE p-i-n PDs with a periodic absorber structure weredemonstrated by Huang et al. to detect 870-nm wavelength[16]. Figure 16(a) depicts the schematic structure of a typicalRC photodiode with a single absorbing layer placed in awave antinode position. In order to improve quantum efficiencyof RCE p-i-n PD, it was proposed to use a tripleFig. 16. Schematic structures of RCE PD with a single absorbinglayer (a) <strong>and</strong> resonant-periodic-absorber RCE PD with triple layersas the absorbing medium (b) (after Ref. 16).Opto-Electron. Rev., 12, no. 1, 2004 J. Kaniewski 145

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