PCB Depaneling Laser System LPKF MicroLine 350Ci

PCB Depaneling Laser SystemLPKF MicroLine 350Ci■ Depaneling without mechanical stress■ Dust free environment■ Cut any shapes■ More usable space for component placement■ Superior throughput

Laser cutStress free cutting and improved productivity:Introducing laser technology for depanelingDepaneling of modern HD circuit boards can be frustrating.Avoiding damaging small, sensitive components, maintainingthe close tolerances required by densely packed boards andavoiding the pollution caused by mechanical routers are allpart of the challenge.The LPKF MicroLine 350Ci meets these challenges byusing laser technology for depaneling and routing. Non-contactcutting with a laser means no mechanical stress on the boardsor components, no debris, and no extra cost for tooling. Thehigh positioning accuracy of the 350Ci allows for componentplacement closer to the edge of a board. The laser beam isable to cut intricate shapes and also increases the net usablearea on the panels.Produce more challenging designsThe MicroLine 350Ci will cut arbitrary shapes without any mechanicalimpact on the circuit. PCB designers will enjoy theliberty to place components closer to the edge of the board orto utilize more intricate shapes to better fit the form factor ofthe final product.Cutting arbitrary shapes withsmallest tool diametersHigh productivityThe superior cutting speed of the MicroLine 350Ci providesbetter overall productivity than traditional depaneling methods,especially with thinner materials.Maximum Cutting Speed FR4Superior quality and instant turnaroundLaser cutting is significantly more precise than other depanelingmethods. It doesn’t generate any debris or dust that couldaffect sensitive electronic components. The system worksstraight from CAD data and does not require specific tooling,so even small quantities can be produced instantly.Feed Rate (millimeter per sec.)400350300250200150100500.5 1 1.5Material Thickness (millimeter)

LPKF MicroLine 350Ci – Integrate Tomorrow’s Technologyin Today’s Production LineThe dual camera system providesinstant fiducial recognitionon the entire working areafor optimal productivity.The integrated dust and fumeextraction provides a clean workingenvironment for guaranteedsuperior production quality.The cartridge loading systemaccommodates custom holdingfixtures for maximum efficiency.The intuitive CAM software iseasy to use and compatible withall industry standards includingGerber, ODB++, DXF, Excellon,HP-GL, and others.Compact and easy to integrateWith its small footprint the LPKF MicroLine 350Ci can beeasily integrated into an existing PCB assembly line or usedas a stand-alone system. The software features extensivelaser control functions combined with an easy-to-use GUI forday-to-day operation.LPKF has been providing prototyping and production equipmentto the electronic industry for almost 30 years. Our systemsare designed with superior precision, minimum maintenancerequirements and maximum uptime in mind. LPKFprovides a directly employed worldwide service staff supportingyou every step of the way.

Specifications LPKF MicroLine 350CiWorking areaOverall accuracyLaser sourceLaser safetyDimensions (W/H/D)WeightFacility connectionsPowerChillerFume extractionAirApplicationsSemiautomatic depanelization of populatedcircuit boards.MaterialsMaximum material thicknessMaximum component heightAutomated loading station440 mm x 310 mm x 30 mm±20 µmCO 2 laserClass 11,264 mm x 1,670 mm x 2,023 mmca. 1,600 kg3 phase 400 V + N + PE, 50/60 Hz, 32 A, power consumption 8 kVADI water, 2.5 kVA, min. 7 l/min, 23 °C ±1 °C150 CFM (250 m 3 /h)@80” w.c. (20,000 pa), 3 psi (0,2 bar), carbon filtration required90 psi (6 bar)FR4, FR3, FR2, Polyester, Polyimid, PMMA, Polyamid, Prepreg0.8” (2 mm)top side 1.2” (30 mm)bottom side 0.6” (15 mm)custom designed loading station availableLPKF Laser & Electronics AGOsteriede 7D-30827 GarbsenGermanyPhone +49 (0) 5131-70 95-0Fax +49 (0) 5131-70 95-90info@lpkf.dewww.lpkf.comLPKF-DistributorLPKF AG, 117562-1005-EN