Component Technology Pte Ltd - Singapore Institute of ...

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Business Model Change:From Equipment Distribution to Manufacturing‣ In 2006, our revenue reached a new height,but the competition became more intense.‣ With assistances from SIMTech/PECOI andSpring, we ventured into semiconductorinspection equipment developmentCopyright © 2013 All rights reservedComponent Technology Pte Ltd
Wirebond Inspection: a Niche Market‣ Wire bonding has been widely used forIC, discrete, LED and power devicepackaging for decades. The driver for100% wire bond device inspectioncomes from car industry.‣ Requirement 1: On-the-fly wirebond2D/3D inspection with accuracy 10um,FOV 15mm x 15mm‣ Requirement 2: Inspect thick wires(diameters 4mil – 10mil) and gold wire(diameters 0.8mil)Copyright © 2013 All rights reservedComponent Technology Pte Ltd
Page 1: From EquipmentDistribution To Equip
Page 6 and 7: Technical ChallengesTo perform an a
Page 8 and 9: Product Launch in 2008 Japan Semico
Page 10: FutureFuture depends on whetherwe w

Component Technology Pte Ltd - Singapore Institute of ...

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