Component Technology Pte Ltd - Singapore Institute of ...
Component Technology Pte Ltd - Singapore Institute of ...
Component Technology Pte Ltd - Singapore Institute of ...
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From EquipmentDistribution To EquipmentManufacturing<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong>Presented by Managing Director <strong>of</strong><strong>Component</strong> <strong>Technology</strong>Berne Chung11 April, 2013
<strong>Component</strong> <strong>Technology</strong>: A Company With 20 Years OfExcellency In Semiconductor Equipment Distribution<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong> is a <strong>Singapore</strong> basedcompany with 20 years <strong>of</strong> experience in distribution <strong>of</strong>wire/die bonder and X-ray inspection systems forsemiconductor industry. Currently, we have over 100staff members located in <strong>Singapore</strong>, Malaysia, Taiwan,Japan and China1989 - Established <strong>Component</strong> <strong>Technology</strong> in<strong>Singapore</strong>1991 - Established CNT <strong>Technology</strong> in Malaysia. Officesnow in Melaka, Penang & Kuala Lumpur2010 - Established In D. Solution in <strong>Singapore</strong>We devote ourselves in aggressive involvement inContinuous Improvement Program (CIP)through leveraging on Quality, <strong>Technology</strong>, Cost,Logistics and Services forlong term business cooperation and partnershipCopyright © 2013 All rights reserved<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong>
Business Model Change:From Equipment Distribution to Manufacturing‣ In 2006, our revenue reached a new height,but the competition became more intense.‣ With assistances from SIMTech/PECOI andSpring, we ventured into semiconductorinspection equipment developmentCopyright © 2013 All rights reserved<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong>
Wirebond Inspection: a Niche Market‣ Wire bonding has been widely used forIC, discrete, LED and power devicepackaging for decades. The driver for100% wire bond device inspectioncomes from car industry.‣ Requirement 1: On-the-fly wirebond2D/3D inspection with accuracy 10um,FOV 15mm x 15mm‣ Requirement 2: Inspect thick wires(diameters 4mil – 10mil) and gold wire(diameters 0.8mil)Copyright © 2013 All rights reserved<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong>
Technical ChallengesTo perform an automatic wire bondinspection, a number <strong>of</strong> challenges need tobe addressed:‣ Wires on a leadframe are highlyspecular. Illumination needs to bedesigned to minimize the specularity toensure accurate 3D measurement. Atthe same time, good contrasts on othersurfaces such as die and bond padsshould be guaranteed for 2Dmeasurements‣ Conventional correlation basedstereo 3D reconstruction may fail dueto reflection image differences in stereopairCopyright © 2013 All rights reserved<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong>
3D <strong>Technology</strong> Development‣ We developed 27 know-hows andinnovations in stereo illumination,camera calibration, knowledge based2D and 3D image processing forwirebond inspection and filed two USpatents‣ Created the world’s first <strong>of</strong> its kind 3Dwire bond inspection systemCopyright © 2013 All rights reserved<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong>
Product Launch in 2008 Japan Semicon‣ We have invested over 5mil S$ since 2006‣ We launched the world’s first 3D wirebond inspection system inJapan Semicon 2008‣ We established our R&D arm In D. Solution <strong>Pte</strong> <strong>Ltd</strong> in <strong>Singapore</strong>recruiting over 30 research engineers‣ We developed 8 key know-how in wirebond related inspectionsand filed two patents (jointly with SIMTech)‣ We sold over 150 systems worldwide‣ We occupy 95% market share <strong>of</strong> 2D/3D wirebond inspectionFirst generation 3D systemCopyright © 2013 All rights reserved<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong>Second generation 3D system
Impacts & Productivity Improvement‣ We are the only company capable <strong>of</strong> automaticmeasurement <strong>of</strong> more than 60 wire and die bond relateddefects, 2D and 3D‣ We reduce the inspection time for a typical wirebonddevice from 2.5seconds (manual inspection) to 0.3 second‣ Our second generation machine is able to automaticallygenerate recipe and inspect over 1000 wires, which is nextto impossible for a human inspector.Copyright © 2013 All rights reserved<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong>Second generation 3D system
FutureFuture depends on whetherwe wait for it, orwe make itCopyright © 2013 All rights reserved<strong>Component</strong> <strong>Technology</strong> <strong>Pte</strong> <strong>Ltd</strong>
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