Component Technology Pte Ltd - Singapore Institute of ...

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Technical ChallengesTo perform an automatic wire bondinspection, a number of challenges need tobe addressed:‣ Wires on a leadframe are highlyspecular. Illumination needs to bedesigned to minimize the specularity toensure accurate 3D measurement. Atthe same time, good contrasts on othersurfaces such as die and bond padsshould be guaranteed for 2Dmeasurements‣ Conventional correlation basedstereo 3D reconstruction may fail dueto reflection image differences in stereopairCopyright © 2013 All rights reservedComponent Technology Pte Ltd
3D Technology Development‣ We developed 27 know-hows andinnovations in stereo illumination,camera calibration, knowledge based2D and 3D image processing forwirebond inspection and filed two USpatents‣ Created the world’s first of its kind 3Dwire bond inspection systemCopyright © 2013 All rights reservedComponent Technology Pte Ltd
Page 1: From EquipmentDistribution To Equip
Page 4 and 5: Business Model Change:From Equipmen
Page 8 and 9: Product Launch in 2008 Japan Semico
Page 10: FutureFuture depends on whetherwe w

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