Component Technology Pte Ltd - Singapore Institute of ...

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Product Launch in 2008 Japan Semicon‣ We have invested over 5mil S$ since 2006‣ We launched the world’s first 3D wirebond inspection system inJapan Semicon 2008‣ We established our R&D arm In D. Solution Pte Ltd in Singaporerecruiting over 30 research engineers‣ We developed 8 key know-how in wirebond related inspectionsand filed two patents (jointly with SIMTech)‣ We sold over 150 systems worldwide‣ We occupy 95% market share of 2D/3D wirebond inspectionFirst generation 3D systemCopyright © 2013 All rights reservedComponent Technology Pte LtdSecond generation 3D system
Impacts & Productivity Improvement‣ We are the only company capable of automaticmeasurement of more than 60 wire and die bond relateddefects, 2D and 3D‣ We reduce the inspection time for a typical wirebonddevice from 2.5seconds (manual inspection) to 0.3 second‣ Our second generation machine is able to automaticallygenerate recipe and inspect over 1000 wires, which is nextto impossible for a human inspector.Copyright © 2013 All rights reservedComponent Technology Pte LtdSecond generation 3D system
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Page 10: FutureFuture depends on whetherwe w

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