NEXT BIOMETRICS

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Q1/Q2/Q3 – 2013…case summary200.000ASIC’sproducedProduction ReadyMobile ModuleInvestment case summaryPCB Modules and USBSensorsFingerprint biometricsmarket set to take off$ 15.8 mill equityraisedJan Mar May Jul Aug Sep1’st SmartphoneProject Initiated
OCTOBER – 2013…First commercial PCBmodulecompletedFirst silicon of new costand space savingASIC received in SeattleFirst complete phonedemonstrated to<strong>NEXT</strong> in Asia(not this design)Investment case summaryWeek 1 Week 2 Week 3 Week 4Hunter Hu recruited as SalesManager of <strong>NEXT</strong> China.2 experienced FAE’s recruitedin ShanghaiFingerprint biometricsmarket set to take offSeattle staff with three newexperienced engineers.Out of 11 Seattle engineers, fivespeaks mandarin.Proven technology withcredible mass marketreferencesINNOLUX CORPORATION CEOand CTO pledges increased projectsupport
Page 2 and 3: NEXT management teamInc Board of Di
Page 4 and 5: Credible mass market referencesVOLU
Page 6 and 7: Fingerprint sensor market - 2013 Ch
Page 8 and 9: The core technologyArea sensor tech
Page 12 and 13: Significant “NEXT-enabled” grow
Page 14 and 15: TOTAL COSTASIC size and cost road m
Page 16 and 17: Units (million)Significant “NEXT-
Page 18: Investment case summaryFingerprint

NEXT BIOMETRICS

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