On-Board Type (DC) EMI Suppression Filters (EMIFILr)
On-Board Type (DC) EMI Suppression Filters ("EMIFIL")
On-Board Type (DC) EMI Suppression Filters ("EMIFIL")
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!Note • This !Note PDF catalog • Please is downloaded read rating and from !CAUTION the website (for of Murata storage, Manufacturing operating, rating, co., ltd. soldering, Therefore, mounting it’s specifications and handling) are in subject this catalog to change to prevent or our smoking products and/or in it may burning, be discontinued etc. without advance notice. Please check with our<br />
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.<br />
C31E.pdf<br />
08.9.1<br />
<strong>EMI</strong>FILr (Soldering and Mounting)<br />
Continued from the preceding page.<br />
(in mm)<br />
Series Solder Paste Printing Adhesive Application<br />
NFA<br />
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for<br />
pattern printing.<br />
oCoat with solder paste to the following thickness:<br />
100-200µm: NFA31G/31C<br />
100-150µm: NFA18S/21S<br />
NFA31G/31C<br />
2.6 0.6 0.5 1.5<br />
NFA21S<br />
0.5<br />
2.2<br />
1.0<br />
0.4<br />
1.75<br />
0.3 0.8 pitch<br />
0.25 0.25<br />
0.25<br />
0.75<br />
NFA18S<br />
0.175<br />
1.375<br />
0.225<br />
0.4<br />
0.05<br />
0.175<br />
1.3<br />
2.0<br />
NFW31S<br />
NFE31P<br />
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for<br />
pattern printing.<br />
oCoat with solder paste to the following thickness:<br />
150-200µm<br />
NFW31S Series<br />
Apply 0.2mg of bonding agent at each chip.<br />
1.0<br />
0.6<br />
2.6<br />
0.6<br />
2.2<br />
4.2<br />
Bonding agent<br />
Coating positon of<br />
bonding agent<br />
NFE61P<br />
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for<br />
pattern printing.<br />
oCoat with solder paste to the following thickness:<br />
150-200µm<br />
Apply 1.0mg of bonding agent at each chip.<br />
0.6<br />
1.2<br />
3.2<br />
1.5<br />
4.8<br />
8.8<br />
1.6<br />
2.6<br />
Bonding agent<br />
1.5<br />
4.8<br />
9.0<br />
Bonding agent<br />
Continued on the following page.<br />
6<br />
183
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