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Annual report 2000 - Europractice

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EUROPRACTICE<br />

offers deep submicron layout service<br />

Deep submicron layout generation<br />

is a difficult task. Lots of effects are<br />

to be considered and can cause serious<br />

problems for your circuits:<br />

clock-skew, latency of interacting<br />

clocks, IR-drop on power-distribution,<br />

electro-migration problems,<br />

delays caused by the interconnect,<br />

handling 5 or more layers of metal<br />

in the back-end.<br />

EUROPRACTICE IC Service is<br />

providing a deep submicron layout<br />

service, starting from gate-level<br />

netlist. The service includes clocktree<br />

synthesis, and provides information<br />

allowing the circuit designers<br />

to verify accurate post-layout<br />

timing using timing simulation or<br />

Layout of 29 Kgates circuit with<br />

11 RAM blocks in Alcatel Microelectronics<br />

0.35µ CMOS (5-metallayers)<br />

- 20 mm 2 (By courtesy of IMEC).<br />

static-timing analysis. All information<br />

is provided to automatically<br />

update the circuit in an incremental<br />

way, using in-place optimisation<br />

in the synthesis tool. This can involve<br />

buffer insertion, cell replacement,<br />

and local re-synthesis. Placement-iterations<br />

typically are done<br />

within 24 hours, providing complete<br />

feedback to redo all verifications.<br />

With the Avant! tools, <strong>Europractice</strong><br />

addresses all of the above<br />

mentioned problems.<br />

Many circuits have been taped out<br />

successfully, up to 6 metal-layer<br />

processes, both for in-house developed<br />

Systems-On-a-Chip, as for<br />

ASICs developed by third party design<br />

houses, research institutes and<br />

universities. Several of the circuits<br />

have been systems with analog full<br />

custom blocks, combined with<br />

other macro’s and memories. Procedures<br />

are in place to offer standard<br />

I/O configurations, staggered<br />

I/O configurations, and configurations<br />

with the bonding-pads equal-<br />

Layout of a 130 Kgates circuit in UMC<br />

0.18µ CMOS (6 layers of metal) - 4.5 mm 2<br />

(By courtesy of IMEC).<br />

ly spread over the standard-cell<br />

core, for flip-chip application.<br />

Circuit complexities handled were<br />

up to several hundred thousands<br />

of equivalent gates, system clockrates<br />

up to 200 MHz. Typically,<br />

layout and full verification is done<br />

in 10-15 working days.<br />

Layout of a mixed analog-digital circuit<br />

with 130 Kgates in Alcatel Microelectronics<br />

0.35µ CMOS (5-metallayers)<br />

- 29 mm 2<br />

(By courtesy of IMEC).<br />

7

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