E-mobility Technology Winter 2020

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e-mobility Technology International | Vol 7 | Winter 2020 Roadmap to high voltage and Wide Bandgap Semiconductors PCB embedding technologies like the p² Pack technology will enhance the performance of power electronic applications. Due to its´ very low parasitic inductance this new technology supports low loss switching at high frequencies which is of utmost importance when so called wide band gap semiconductors come into play. The next generation of Automotive drives, which will be equipped with SiC and with GaN devices, is already in development and showing outstanding results. [2] With a built-in insulation it will be possible to assemble the Smart p² Pack directly on the Heat sink. The TIM (Thermal Interface Material) can be chosen either as electrically non-conductive or as electrically conductive material. Additional features Standardization and modularization are important factors for the success of a new technology. Therefore, half bridge designs were built as demonstrators with current sensing by using shunt elements for the measurement of the phase current of an electrical motor. As shunts are relatively large components, miniaturization efforts are supported while reliability improves: Solder joints are replaced by micro – vias for the connection to the board. By embedding the shunt into the p² Pack the heat dissipation from the shunt is improved dramatically which increases the possibility to use shunts for current measurements even for very high currents e.g. 300 A per phase. Conclusions New PCB technologies have the potential to support e-mobility systems by minimizing form factors, increasing the systems´ performance and by reducing the system cost when determined on system level. The embedding of power electronic devices is able to replace conventional power modules, which also improves system performance and reliability significantly and is useful for low voltage applications with highest currents as well as for wide band gap devices in high voltage applications. [2], [5] Acknowledgement The authors acknowledge the contribution of Infineon Technologies AG and the Schweizer Electronics’ Innovations Team to this work. References [1] Adrian Röhrich and Christian Rössle, Chip Embedding of Power Semiconductors in Power Circuit Boards, ATZ elektronics worldwide, 06/2018 [2] C. Marczok, M. Martina, M. Laumen, S. Richter, A. Birkhold, B. Flieger, O. Wendt, T. Päsler: SiC modul - Modular hightemperature SiC power electronics for fail-safe power control in electrical drive engineering. Proceedings CIPS 2020, 11th International Conference on Integrated Power Electronics Systems [3] https://www.schweizer.ag/de/produkteundloesungen/ embedding/p2_Pack.html [4] https://www.infineon.com/cms/en/about-infineon/ press/market-news/2019/INFATV201905-068.html [5] Thomas Gottwald, Christian Roessle : Minimizing form factor and parasitic inductances of Power Electronic Modules: The p² Pack Technology. 7th Electronic System- Integration Technology Conference (ESTC 2018) Figure 9: X-Ray image of a Half-Bridge design with embedded shunt (right). X-sectional view of Half-Bridge design with embedded shunt in the middle (bottom) e-mobility Technology International | www.e-motec.net 141
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VOL 7 | WINTER 2020 FUTURE MOBILITY
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CONTENTS 4 ELECTRIFICATION PLANNING
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ELECTRIFICATION PLANNING The smart,
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Smart depots: Why software integrat
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ne of the big challenges in making
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LiDAR Integration in Autonomous Ele
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Sensing Singular Resolution and Obj
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Driving change: How materials scien
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Further critical factors to EV safe
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POWER ELECTRONICS Semiconductor cho
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INFOTAINMENT AND CONNECTIVITY Infor
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and software, smooth (firmware) upd
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MATERIALS RESEARCH Moving e-mobilit
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Surface solutions for a wide range
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INFOTAINMENT AND CONNECTIVITY Auton
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THE FIRST VIRTUAL TRADE FAIR IN THE
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Advancing EV Electronics with Light
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Adhesives Light-curable adhesives c
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Copper and aluminium wire splicing
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BATTERY TECHNOLOGY An application f
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Open Loop Fluxgate current sensor o
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MATERIALS RESEARCH As automakers st
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Another thing which must not be for
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Smart Home and Smart Power Grid Com
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Accelerating ADAS and AD with End t
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