preliminary - Bad Request - Cern

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C d Cryostat Motherboard Electrode T=90K ~15k ~180k Calibration Preamps Tower Builder Control On Detector (Faraday Cage) Front End Crate Front End Board R c L c Clock Shapers DAC SCA (144 Cells) Control I Layer Sum Buffering & ADC 40MHz CLK LV1 Acc. Reset Controller Optical Link 32 Bits 40 MHz CPU Level 1 Interface System Control Mapping Board E= Σ a S i i T= Σ b S i i TTC Interface Trigger Cavern Calorimeter Monitoring TTC ROD Level 1 Processor Figure 11. Readout chain of the ATLAS liquid argon calorimeter. After the preamplifiers, the readout chain is identical for all the liquid argon calorimeters. The end-cap hadron calorimeter has preamplifiers based on GaAs technology at the electrodes inside the cryostat. Each preamplifier output is split into three shaping amplifiers with different gains and analog (switched capacitor) memories, and then digitized with 12 bit resolution. Data are transferred from the detector via one optical link for every 128 signal channels. 128 outputs 5Ω 0.1% 5Ω 0.1% PMOS 10000/0.8 PMOS 10000/0.8 +5V NE 856 - Low Offset + enable + Low Offset 128 DAC 16 bits 16 Driver White follower 8 Calib Logic SPAC Slave TTCRx Figure 12. Calibration signal generator. A dc current controlled to 0.1% is switched off to generate on an LR network an exponentially decaying current pulse which approximates closely (within the shaping time) the calorimeter signal. Delay CTP 2 2 1 Ext. Trig. Network DAQ
ADC Counts [RMS] 25 20 15 10 Calibration Board Amplitude [V] -0.35 0 No shields MotherBoard & Summing Board R inj PA-out Detector Max Signal 3 TeV ~7.5mA 2.5V Random noise/channel 40MeV 100nA 33µV Sum of 64 channels 320MeV 0.8µA 260µV Coherent noise in the sum ~ 200nA < 64 µV Coherent noise in one channel 3nA
Page 17 and 18: Abstract The construction of the LH
Page 19 and 20: Following a decade of development a
Page 21 and 22: VII. PERFORMANCE AND UPGRADE POTENT
Page 23 and 24: efore, both after scaling. The resu
Page 25 and 26: Abstract Most modern HEP experiment
Page 27 and 28: output of the discriminator a pulse
Page 29 and 30: mechanical rigidity and at the same
Page 31 and 32: Abstract Some principal design feat
Page 33 and 34: Energy → Light Light → Current
Page 35: Accordion Electrodes SB MB Mother B
Page 39 and 40: I. EVOLUTION AND REVOLUTION FPGA pr
Page 41 and 42: This flexibility is essential when
Page 43 and 44: B. Designing for Signal Integrity S
Page 45 and 46: D. Coping with Clock Reflections In
Page 47 and 48: III. ANTIFUSE FPGA TECHNOLOGY FPGA
Page 49 and 50: Figure 4 Schematic drawing of non-T
Page 51 and 52: 1) Non-TMR design FF errors were ob
Page 53 and 54: CrossSection [/bit/cm2] 1.00E-08 1.
Page 55 and 56: Table 1: Characterization of the re
Page 57 and 58: The search direction is opposite to
Page 59 and 60: Design of ladder EndCap electronics
Page 61 and 62: will maintain the token passing for
Page 63 and 64: Analogue switches Figure 14 Analogu
Page 65 and 66: Test Input Analog In Itp Testpulse
Page 67 and 68: data header DataValid AnalogOut[0]
Page 69 and 70: �Ò��Ò �� Ê��
Page 71 and 72: Ì��Ð� � ��×��Ò
Page 73 and 74: PRELIMINARY ��ÙÖ� ��
Page 75 and 76: the simulations are: luminosity of
Page 77 and 78: IV. PIXEL MODULE EXPERIMENTAL RESUL
Page 79 and 80: Radiation tolerance studies of BTeV
Page 81 and 82: Figure 1: Measured amplifier noise
Page 83 and 84: The ALICE Pixel Detector Readout Ch
Page 85 and 86: Control JTAG Multiplicity Pixel JTA
Page 87 and 88:
irradiated chips can be changed by
Page 89 and 90:
I. Preamplifier The preamplifier is
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the error amplifier. As a result, a
Page 93 and 94:
Abstract The front−end system of
Page 95 and 96:
III. Test results of the front−en
Page 97 and 98:
Irradiation and SPS Beam Tests of t
Page 99 and 100:
A. Measurements with Ions In order
Page 101 and 102:
stepping motor. The results are sho
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uffer of the analogue multiplexer i
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The noise performance of the SCTA12
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The ALICE on-detector pixel PILOT s
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C. Data converter The serial-parall
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input logic block a logic block b l
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A Study of Thermal Cycling and Radi
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a result of accelerated oxidation w
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40MHz clock frequency and correspon
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Figure 5: S-curves and noise occupa
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Design and Test of a DMILL Module C
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the correct inputs for the MCC. Dat
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esults that predicted 78 MHz. One h
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There is no common behaviour for th
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the equivalent resistance is almost
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Low Dose Rate Effects And Ionizatio
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Figure 2: Relative beta change (∆
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ABCD chip will remain under specifi
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Since the TSM system is the bottlen
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architecture requires a comparable
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Neutron Radiation Tolerance Tests o
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c) voltage ON/OFF alternating in ra
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B. Optical measurements Plano-conve
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(RoI). It selects the higher trigge
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during communication with jtag tap.
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A Radiation Tolerant Gigabit Serial
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A. Evaluation Tests All the ASIC fu
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fifth workshop on electronics for L
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considered as an electronic friendl
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stored in one bunch crossing. Readi
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A Radiation Tolerant Laser Driver A
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A. Static performance Figure 4 show
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This is attributed to the NMOS type
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programme is that we must validate
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B. Lab simulation of the radiation
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Design and Performance of a Circuit
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Figure 4: Set-up for electrical tes
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Status Report of the ATLAS SCT Opti
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Figure 5 LI curves for VCSELs on a
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Figure 13 Measured noise occupancy
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of the PCB: 23 × 30 mm. The PCB th
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ange within noise spec. It is clear
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An Optical Link Interface for the T
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Not using integrated components mea
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Fig. 2 Open view of the AMT-2chip.
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Jitter[ps] 2.5 300 250 200 150 100
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Anode Front-End Electronics for the
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Input Figure 2: Schematic diagram o
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esulting curve of “propagation ti
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measured during each exposure. The
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IV. CONCLUSIONS The radiation tests
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A. Wilkinson ADC The Wilkinson dual
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D. Noise performance and non-system
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"The MAD", a Full Custom ASIC for t
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(slope of 45 e/pF) and a value belo
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COMPASS, a HEP experiment under con
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From CADENCE simulation the bandwid
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Figure 11: Shaper output for a 1/t
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supports also add-on bus mastering
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Each i-th FEE card has to produce P
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The results are shown in figure 7.
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TIM ( TTC Interface Module ) for AT
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FRONT PANEL 36 x L� EDS NIMINPUTS
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testing the FE and off-detector ele
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Channel B supports several function
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The ECS interface is a Credit Card
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Implementation Issues of the LHCb R
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III. ECS INTERFACE The Experiment C
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VII. PLD MODULES For the first prot
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Abstract CMS REGIONAL CALORIMETER T
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The jets and τs are characterized
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Figure 6. Jet trigger rates for sin
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A. Extrapolation A single Extrapola
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down to 5 clocks (125 ns) from 15 c
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The Sector Logic demonstrator of th
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In the same way, for each muon pass
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Figure 8: Layout of the MFCC with t
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On Detector In Trigger Cavern LAr (
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The ATLAS level-1 calorimeter trigg
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The Final Multi-Chip Module of the
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Analog In ¯ one four-channel PPrAS
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for the test. The signals are condi
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Cluster Processor Jet/Energy Jet En
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an internal DSS memory which was pr
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Prototype Slice of the Level-1 Muon
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Four low-pT CMAs, covering a total
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Figure 9: ATLAS Simulated Total Ion
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��
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WULJJHU HIIL�LHQ�\ $U $U 2 2 3
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Design and Test of the Track-Sorter
Page 281 and 282:
eyond the LHC bunch crossing freque
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Use of Network Processors in the LH
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shortly discussed here. For details
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The network processor is accessed r
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Figure 2 : residuals of a linear fi
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3. FRONT-END BOARDS [8] The Front-e
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4. PRODUCTION STRATEGY Except the S
Page 295 and 296:
The Delta pre-amplifier provides ch
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Output (Volts) 0.32 0.315 0.31 0.30
Page 300 and 301:
Ì�� Ñ�Ü�� Ò�ÐÓ
Page 302 and 303:
��Ò×Ø ÐÓ � ÖÓ×
Page 304 and 305:
Ì�� ÙÒ Ø�ÓÒÒ�Ð
Page 306 and 307:
The production and the test routine
Page 308 and 309:
documented on the web. Baltazar has
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II. LOW VOLTAGE CONTROL OF HEC A. S
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1) Original design We intended to u
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On the developments of the Read Out
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This module has been developed and
Page 318 and 319:
Abstract After reviewing the archit
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portation architecture must allow a
Page 322 and 323:
The Embedded Local Monitor Board (E
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sender automatically re-attempts tr
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2) The result of the functional SEE
Page 328 and 329:
Design of a Data Concentrator Card
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Figure 4: DCC modeling overview The
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selection process. PVSS-II also pro
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Figure 5: Bus activity after a SYNC
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Table 1: DCU Specifications # of ch
Page 338:
Figure 9: ADC DNL in the LIR mode (
Page 341 and 342:
II. A SYSTEMATICAL APPROACH TO DCS
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corresponding FE electronics segmen
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Abstract THE CMS HCAL DATA CONCENTR
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HTR L1A 40MHz Derand. Buffer Derand
Page 349 and 350:
EMI Filter Design and Stability Ass
Page 351 and 352:
dBuV 1 0 2 1 0 1 1 0 4 1 0 5 M I L
Page 353:
The methodology followed in designi
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- > % o . 0 . / 2 9 . . . . - - / 2
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" " 2 0 ? 1 . 8 2 . - / 2 0 > . / 2
Page 360 and 361:
Power Supply and Power Distribution
Page 362 and 363:
for HF transformers and DC supply f
Page 364:
2. J.Bohm, SCT Week Prague 25 − 2
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on fibre composite plates (150-330
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ures 3 and 4 (only one half of the
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Sorting Devices for the CSC Muon Tr
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In addition to that, the MS perform
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Optical Link Evaluation for the CSC
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III. PROTOTYPING RESULTS Two evalua
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DISTRIBUTED MODLAR RT-SYSTEMS FOR D
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equired also for describing of mode
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point links, which eliminated the b
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Technology Independent System archi
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Page 391 and 392:
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Page 393 and 394:
Figure 2: Schematic of Prototype Ev
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D. Irradiation Results on the Inter
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Printed Circuit Board Signal Integr
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Package Parasitic GND R_pkg L C_pkg
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Figure 8: ALICE Pixel System Detect
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are described in [8]. The temperatu
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The Behavior of P-I-N Diode under H
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Figure 5: Numerical (line) and expe
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Elements Silicon sensors Table 1: T
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Table 2: Dominant radionuclides con
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VII. REFERENCES [1] I.Dawson, Revie
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LHC_CLK DATA_L[15..0] DATA_VALID_L
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the ionization takes place, and the
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Figure 2: Sketch of kinematics of t
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Figure 1. The ROD -Busy tree struct
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for setting the base address of the
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Optically Based Charge Injection Sy
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Figure 6: Measured crosstalk. A sig
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them through the connectors. The ju
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trigger type parameter (8 bit), whi
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¯ ÅÙÐØ�ÔÐ� × �ØØ�
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×Ø�Ô �Ý ×Ø�Ô ÓÒ�
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• a 4-channel ASIC of a different
Page 439 and 440:
structures. One should acknowledge,
Page 441 and 442:
New building blocks for the ALICE S
Page 443 and 444:
4 is more sensitive than the archit
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