EPF R-79 Ball Grid Array (BGA) teknologi - IVF
EPF R-79 Ball Grid Array (BGA) teknologi - IVF
EPF R-79 Ball Grid Array (BGA) teknologi - IVF
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Innhold<br />
<strong>EPF</strong> R-<strong>79</strong> <strong>Ball</strong> <strong>Grid</strong> <strong>Array</strong> - <strong>teknologi</strong> © <strong>EPF</strong> 1997<br />
2<br />
SAMMENDRAG.....................................................................................................................................................3<br />
INNLEDNING.........................................................................................................................................................4<br />
UTGANGSPUNKT FOR PROSJEKTET ...............................................................................................................................5<br />
PROSJEKTPLAN OG GJENNOMFØRING............................................................................................................................6<br />
ØKONOMI...................................................................................................................................................................8<br />
SEMINAR....................................................................................................................................................................8<br />
BEGREPER OG MENINGER ............................................................................................................................................9<br />
<strong>BGA</strong>-TEKNOLOGI ..............................................................................................................................................10<br />
UTVIKLINGSTREND...................................................................................................................................................10<br />
HVA ER EN <strong>BGA</strong>-KOMPONENT? .................................................................................................................................10<br />
<strong>BGA</strong>-KOMPONENTER I OFM-PRODUKSJON ...............................................................................................13<br />
<strong>BGA</strong>-TESTKORT.......................................................................................................................................................13<br />
<strong>BGA</strong> plassering og daisy-chain mønster på testkortet .........................................................................................17<br />
<strong>BGA</strong>-MONTASJE.......................................................................................................................................................18<br />
Monteringsparametre .........................................................................................................................................18<br />
Loddeprofiler......................................................................................................................................................19<br />
Kommentarer til montasjeprosessen....................................................................................................................21<br />
Monteringsresultat..............................................................................................................................................23<br />
REWORK ..................................................................................................................................................................23<br />
PÅLITELIGHET VED <strong>BGA</strong>-MONTASJE..........................................................................................................................25<br />
EVALUERING AV <strong>BGA</strong>-TESTKORT................................................................................................................26<br />
TEMPARATURSYKLING..............................................................................................................................................26<br />
Instrument liste...................................................................................................................................................28<br />
Måleresultater ....................................................................................................................................................28<br />
Status på <strong>BGA</strong>-testkort under temperatursykling.................................................................................................31<br />
MIKROFOKUSRØNTGEN.............................................................................................................................................32<br />
Kommentarer fra <strong>IVF</strong>..........................................................................................................................................35<br />
Variasjon i porestørrelse.....................................................................................................................................36<br />
DESTRUKTIV EVALUERING ........................................................................................................................................37<br />
Mikroslip ............................................................................................................................................................37<br />
“Twist-off” test...................................................................................................................................................37<br />
STUDIETUR .........................................................................................................................................................39<br />
HENSIKT ..................................................................................................................................................................39<br />
HVEM VI SKULLE BESØKE ..........................................................................................................................................39<br />
TEMAER TIL DISKUSJON ............................................................................................................................................39<br />
OPPSUMMERING AV INNTRYKK ..................................................................................................................................40<br />
STATUS <strong>BGA</strong> HOS MOTOROLA..................................................................................................................................40<br />
KONKLUSJONER................................................................................................................................................41<br />
YTTERLIGERE KOMMENTARER ..................................................................................................................................42<br />
ANDRE FORHOLD......................................................................................................................................................43<br />
PUBLIKASJONER .......................................................................................................................................................43
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