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05-2006, Tema Förbindningsteknik (7 Mbyte, pdf) - Elektroniktidningen

05-2006, Tema Förbindningsteknik (7 Mbyte, pdf) - Elektroniktidningen

05-2006, Tema Förbindningsteknik (7 Mbyte, pdf) - Elektroniktidningen

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The Print: To start at the beginning, what<br />

needs to be changed to produce RoHS<br />

compliant products?<br />

Vidar Wernöe: First of all designers need<br />

to find components that comply with the<br />

directive. Secondly they need to manufacture<br />

the product in a leadfree process. As for the<br />

banned substances, the issue is about removing<br />

lead without affecting the product`s long term<br />

reliability.<br />

The P: And?<br />

VW: Well, essentially there are several key<br />

problems that arise, at the component, PCB<br />

and layout levels and at a political one. For the<br />

first; when using the viable alternatives such<br />

as a tin/silver/copper compound (SAC), much<br />

higher soldering temperatures are required<br />

(around 40ºC higher) which can lead to serious<br />

overheating problems. Such problems may occur<br />

where products include components of greatly<br />

different thermal mass e.g in power electronics.<br />

Surface mount electrolytic capacitors, for<br />

example, are temperature-sensitive and<br />

overheating can cause irreparable damage.<br />

The P: Can they not be developed to<br />

withstand more heat?<br />

VW: Yes they can. The Japanese, for example,<br />

have been doing leadfree soldering for<br />

some time now, but mainly for consumer<br />

electronics. For industrial products we have a<br />

lack of reliability data and this is a problem. The<br />

production process window has, in leadfree,<br />

become much tighter and this requires a careful<br />

CAD version of heat reliefs<br />

design. Designers need to analyse not only the<br />

electrical data of a component but also examine<br />

the the process temperature specifications.<br />

Ideally a component should sustain a process<br />

temperature of 260 ºC. Components exposed<br />

for over-temperature may cause faults that may<br />

not be detected straightaway in the final tests.<br />

So designers need to go through each single<br />

component used, in order to check its RoHS<br />

compliance, electrical data and the soldering<br />

parameters. This can easily entail checking<br />

the data of more than 1000s of part numbers<br />

for each single new product design or design<br />

change/product update. There is also a key<br />

political issue. Here in Sweden for example<br />

we have asked the Swedish authoritative<br />

body KEMI for guidance regarding proving<br />

compliance and what kind of documentation<br />

they want us to show. They have declined to<br />

give such guidelines however and it may cause<br />

tremendous additional work if it has to be done<br />

retrospectively after a development project is<br />

closed.<br />

The P: You also mentioned PCBs and layout?<br />

VW: Yes. Again because of the effects of the<br />

higher temperatures, the board can warp in<br />

the surface mount production process if there<br />

is an imbalance in the distribution of copper<br />

used. A recommendation is to use “teardrops”<br />

in the layout design. This is where, when a wire<br />

connects to a via, it does not go straight in but<br />

the end is teardrop-formed for extra mass to<br />

diminish the chances of it disconnecting when<br />

heated up. In addition, for larger hole-mounted<br />

components that connect to a larger copper<br />

layer, so-called “heat reliefs” are required to<br />

be able to get an acceptable solder result.<br />

Another recommendation is to widen the hole<br />

slightly. During a leadfree soldering process,<br />

the PCB will be exposed to higher temperatures<br />

than in the past. As a consequence the PCB<br />

matieral chosen is an issue but the key issue is<br />

not to overspecify. Polyclad FR4 370 has better<br />

qualities than standard FR4. It has a high Tg, less<br />

z-value expansion at higher temperatures and<br />

delamination takes longer, but the higher costs<br />

must be weighed up against precise needs.<br />

The P: Inspite of the mammoth amounts of<br />

extra work, are the efforts worth it?<br />

VW: Oh yes. In about a year and a half`s time,<br />

I think the dust will have settled and even<br />

those getting to grips with the issues late will<br />

be producing good quality products with long<br />

reliability guarantees, but there is still some way<br />

to go at a political level to ensure that RoHS<br />

compliancy can be proven and audited in an<br />

appropriate and consistent manner. My advice is<br />

to ask and look for other company`s experience<br />

in RoHS design. We at Elektronikkonsult have,<br />

for example, published our best practices on our<br />

website. This information can be downloaded at<br />

www.elektronikkonsult.se<br />

The P: Finally, we have to ask. As a customer<br />

of Elprint since 2004 are you a happy one?<br />

VW: The Elprint service is reliable, quick, cost-<br />

effective and with a wide product range and<br />

choice of materials so the answer must be yes!<br />

Heat reliefs are recommended for larger<br />

hole-mounted components

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