drupa mycatalog 2004 - Interpack

interpack08 interpack08
Processes and Packaging Processes and Packaging
www.interpack.com mycatalog 2008 www.interpack.com mycatalog 2008
PRODUCT OVERVIEW
04.01.13 Software solutions for the packaging industry
PRODUCT DETAILS
04.01.13 Software solutions for the packaging industry
B-SIM
Computer simulation of blow molding and "sleeve shrinkage"
B-SIM is a software package for simulation of blow molding. B-SIM
predicts the final wall thickness distribution based on the specified
processing parameters (the pressure level, the speed of tools, the
parison / preform initial temperature distribution etc.). B-SIM also can
predict image distortion and pre-distortion based on "sleeve shrinkage
(shrink sleeve)" process.
Features of B-SIM
* Simulates extrusion blow molding from parison
* Simulates stretch blow molding from preform
* Time dependent deformation is described by viscoelastic K-BKZ
model
* Three different damping functions for a better material data fit (strain
hardening)
* WLF temperature dependency
* Material database containing PE, PP, PET, PC, PMMA, ...
* Imports general 3D molds from IGES, VDA-FS via stereolithographic
STL file, DXF or Patran Neutral file
* All molds movable (up to 10 tools can be used in one simulation
project)
* Time dependent parison sagging included
* Friction between stretched plastic material and plug
* Heat transfer between material / molds and material / air *
User-friendly setup of technological parameters with graphic
* Windows context sensitive help, tutorials and hands-on examples
* OpenGL included, allowing dynamic image rotation, zooming and
panning. This enables fast shading or wireframes and contact
visualization options
* Easy, completely editable setup of B-SIM project for solver. Tight
connection between initial project and result files
* Many typical blow molding problems solved and distributed as
examples on installation CD
T-SIM Simulation of thermoforming
T-SIM is a software package for simulation of thermoforming. T-SIM
predicts the final wall thickness distribution based on the specified
processing parameters (the pressure level, the speed of tools, the sheet
temperature distribution etc.). T-SIM also can predict image distortion
and pre-distortion.
Features of T-SIM
* Simulates positive / negative forming with / without plug
assistance
* Time dependent deformation is described by viscoelastic K-BKZ
model
* Three different damping functions for a better material data fit (strain
hardening)
* WLF temperature dependency
* Material database containing PE, PP, PET, PC, PMMA, * Imports
general 3D molds from IGES, VDA-FS via stereolithographic STL file,
DXF or Patran Neutral file
* All molds movable (up to 10 tools can be used in one simulation
project)
* Time dependent sheet sagging included
* Friction between stretched plastic material and tools * Heat transfer
between material / tools and material / air
* User-friendly setup of technological parameters with graphic
* Windows context sensitive help, tutorials and hands-on examples
* OpenGL included, allowing dynamic image rotation, zooming and
panning. This enables fast shading or wireframes and contact
visualization options.
* Easy, completely editable setup of T-SIM project for solver. Tight
connection between initial project and result files.
* Many typical thermoforming problems solved and distributed as
examples on installation CD
T-SIMFIT
* T-SIMFIT program calculates viscoelastic parameters of K-BKZ model
based on the measured stress / strain data.
* Biaxial stress-strain curves at different strain rates and different
temperatures must be measured and entered into T-SIMFIT.
* Export of the material model parameters in T-SIM / B-SIM material file
format. The exported file is directly readable by T-SIM / B-SIM.
* T-SIMFIT user has to have good knowledge of the viscoelastic
material behavior. For this reason, the best way how to get a material
into T-SIM or B-SIM is to ask us to arrange the testing and to fit the
material parameters. As a result, you will receive a material data file
directly readable by T-SIM / B-SIM.
© 2008 Messe Düsseldorf 3675