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Combined use of in-situ curvature and full- wafer ... - Laytec

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Monitor<strong>in</strong>g the temperature pr<strong>of</strong>ile across the whole <strong>wafer</strong><br />

Temperature ( o C)<br />

Aixtron Argus temperature pr<strong>of</strong>iler<br />

1200<br />

1000<br />

800<br />

600<br />

400<br />

Wafer centre<br />

Wafer edge<br />

200<br />

0 2000 4000 6000 8000<br />

Time (s)<br />

(d)<br />

Susceptor<br />

Si slips due to the temperature nonuniformity<br />

across the <strong>wafer</strong>, result<strong>in</strong>g <strong>in</strong><br />

very bowed <strong>wafer</strong>.<br />

Susceptor C B A B C<br />

Wafer<br />

1062<br />

1052<br />

1042<br />

1032<br />

1022<br />

1012<br />

1002<br />

992<br />

982<br />

972<br />

962<br />

Temperature ( o C)<br />

After Si slip<br />

1060<br />

1040<br />

1020<br />

1000<br />

980<br />

960<br />

940<br />

Centre<br />

Edge<br />

11

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