NIP REPORT January 2006- May 2007 - The UP College of Science ...

compounds (PFCs) emitted from the semiconductor industry, and decomposition of toxic gases
like CF4.
This proposed study will be a continuation of the research project entitled “Development
of a Compact Multi-Cusp ECR Ion Source for Plasma Applications” supported by OVCRD in
the year 2001. The newly-developed microwave plasma device was constructed because it does
not require a filament or cathode for plasma generation, unlike the other existing DC plasma
devices in the PPL. The disadvantages of using a filament or cathode are: sputtering or
evaporation of the filament or cathode produces contaminants in the plasma; and the replacement
of broken filament or cathode is laborious and requires breaking the vacuum of the chamber.
The microwave plasma device avoids these complications. Furthermore, the microwave plasma
device is already proven internationally to have a wide-variety of applications as a source of
highly-charged ions or as a device for plasma processing.
Intel Research Grant
Project Title: Gas Discharge Ion Source Applications in IC Packaging
Duration: One Year (April 16, 2007 to April 16, 2008)
Amount/Fund: 8,000 USD (P396,000.00 @49.5:1USD)
Goal
For enhanced imaging and microanalysis using standard devices, the specimen
has to be ultra-clean. The GDIS is compact, low energy and can be retrofitted to a
characterization machine as part and parcel of it.
The ion beam can be focused and energized to desired values for precise removal
of specific materials from sample surfaces.
Project Leader: Dr. Henry J. Ramos
Lab Members and Students involved:
PhD holder: Dr. Gene Q. Blantocas
PhD: Virginia R. Noguera
MS: Adonis Flores
Melissa Camacho
In this project, we wish to demonstrate the capability of the Gas Discharge Ion Source as
a plasma cleaning device and determine the balance between the physical and chemical
processes in the cleaning or etching of samples. Gas chemistry in the plasma process will be
tailored for proper selectivity and anisotropy for specific applications. The operating conditions
(such as plasma discharge current, volume ratio of gas mixtures, input power, ion fluxes, process
pressure and treatment time) for optimum cleaning of various specimens will be established. The
first phase of the project covers the putting up of the facility, its characterization and assessment
of polyimide removal on silicon using plasma cleaning process. The second phase is on the
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