NIP REPORT January 2006- May 2007 - The UP College of Science ...
NIP REPORT January 2006- May 2007 - The UP College of Science ...
NIP REPORT January 2006- May 2007 - The UP College of Science ...
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3 C.M.N. Mateo, A.T. Garcia, F.R.M. Ramos and A.A. Salvador, “Strain-induced valenceband<br />
splitting in the Epitaxially lifted <strong>of</strong>f GaAs on Silicon”, 24th SPP Proceedings,<br />
poster presentation (Davao City, Philippines, October <strong>2006</strong>)<br />
LISTS OF CONFERENCES<br />
1. M. F. Casco, J. V. Misa, M. Defensor, A. Garcia and A. Salvador, “Surface Structure<br />
Dependent Growth <strong>of</strong> InAs/InAlAs Quantum Wires on InP(100) Substrate” Intl. Conf. on<br />
Materials for Advanced Technologies (July <strong>2007</strong>)<br />
persons attended: Ma. Frantessa Casco and Alipio Garcia<br />
date: July 1-6, <strong>2007</strong><br />
venue: Suntec Singapore International Convention & Exhibition Center,<br />
Singapore<br />
2. J. V. Misa, M. F. Casco, A. Garcia and A. Salvador, “Control <strong>of</strong> the Surface Morphology<br />
<strong>of</strong> MBE-Grown InxAl1-xAs and InxGa1-x As Layers on InP Via Manipulation <strong>of</strong> In<br />
Content” Intl. Conf. on Materials for Advanced Technologies (July <strong>2007</strong>)<br />
person attended: Ma. Frantessa Casco and Alipio Garcia<br />
date: July 1-6, <strong>2007</strong><br />
venue: Suntec Singapore International Convention & Exhibition Center,<br />
Singapore<br />
PROJECTS<br />
Program for the Development <strong>of</strong> Devices and Integrated Circuits Suitable for RF<br />
Applications: Period: October 2005 – December <strong>2006</strong> (DOST/PCASTRD)<br />
Amount/Fund: PhP 8,020.372.80<br />
This program aimed to produce GaAs-based field effect devices and millimeter wave<br />
integrated circuits (MMICs) suitable for RF applications. For the first phase <strong>of</strong> the project, the<br />
goal was to establish the protocols for the growth, fabrication and characterization <strong>of</strong> transistors<br />
and passive components. <strong>The</strong> wafers were grown by molecular beam epitaxy (MBE) and<br />
fabricated into High Electron Mobility Transistors (HEMTs) using the facility set up by the<br />
group. <strong>The</strong> new photolithographic masks used for the devices were specifically designed for RFtesting.<br />
<strong>The</strong> wafer and device optical and electrical characteristics were measured in-house,<br />
while their RF characteristics were extracted using the Network Analyzer facility (MicroLab<br />
Group, <strong>UP</strong> EEE Department) as potential calibration data for future devices. <strong>The</strong> Reactive Ion<br />
Etcher setup (Shono Laboratory, NEC) was also repaired for future use in high yield 1-µm gate<br />
FET device and airbridge fabrication.<br />
In addition to testing and calibration <strong>of</strong> the transistor devices, the group also explored<br />
other properties <strong>of</strong> GaAs-based layers. Induced strain in GaAs was observed using the Epitaxial<br />
Lift-Off (ELO), with changes in the heavy-hole and light-hole splitting observed through low<br />
temperature PL experiments. Variation in the growth parameters for quantum dots (QDs) was<br />
done to tailor their emission wavelengths. QDs were also incorporated into quantum wells<br />
(QWs) and phonon assisted optical transitions were observed in the electroluminescence spectra<br />
<strong>of</strong> these structures. Lattice-matched growth <strong>of</strong> InP-based devices was also optimized for future<br />
87