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AN-9044 - Fairchild Semiconductor

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3. Package and Pin Description<br />

Mini DIP (SPM3) Application Note (2012-07-09)<br />

Package drawings are provided as a service to customers considering <strong>Fairchild</strong> components. Drawings may change in any manner<br />

without notice. Please note the revision and/or date on the drawing and contact a <strong>Fairchild</strong> <strong>Semiconductor</strong> representative to verify or<br />

obtain the most recent revision. Package specifications do not expand the terms of <strong>Fairchild</strong>’s worldwide terms and conditions, specifically the<br />

warranty therein, which covers <strong>Fairchild</strong> products.<br />

Always visit <strong>Fairchild</strong> <strong>Semiconductor</strong>’s online packaging area for the most recent package drawings:<br />

http://www.fairchildsemi.com/packaging/.<br />

3.1 Outline Drawings<br />

© 2008 FAIRCHILD SEMICONDUCTOR - Smart Power Module<br />

12<br />

Pin Arrangement<br />

1 VCC(L) 12 VS(U) 23 NW<br />

2 COM 13 IN(VH) 24 U<br />

3 IN(UL) 14 VCC(VH) 25 V<br />

4 IN(VL) 15 VB(V) 26 W<br />

5 IN(WL) 16 VS(V) 27 P<br />

6 VFO 17 IN(WH)<br />

7 CFOD 18 VCC(WH)<br />

8 CSC 19 VB(W)<br />

9 IN(UH) 20 VS(W)<br />

10 VCC(UH) 21 NU<br />

11 VB(U) 22 NV

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