AN-9044 - Fairchild Semiconductor

4. Internal Circuit and Features
Mini DIP (SPM3) Application Note (2012-07-09)
Figure 4.1 illustrates the internal block diagram of the Mini DIP SPM. It should be noted that the Mini
DIP SPM consists of a three-phase IGBT inverter circuit power block and four drive ICs for control functions.
The detailed features and integrated functions of Mini DIP SPM and the benefits acquired by using it are
described as follows.
Features
(19) V B(W)
(18) V CC(H)
(17) IN (WH)
(20) V S(W)
(15) V B(V)
(14) V CC(H)
(13) IN (VH)
(16) V S(V)
(11) V B(U)
(10) V CC(H)
(9) IN (UH)
(12) V S(U)
(8) C SC
(7) C FOD
(6) V FO
(5) IN (WL)
(4) IN (VL)
(3) IN (UL)
(2) COM
(1) VCC(L) VB
VCC
COM
IN
VB
VCC
COM
IN
VB
VCC
COM
IN
C(SC)
C(FOD)
VFO
IN(WL) OUT(VL)
IN(VL)
IN(UL)
COM
VCC
OUT(WL)
OUT(UL)
© 2008 FAIRCHILD SEMICONDUCTOR - Smart Power Module
OUT
20
VS
OUT
VS
OUT
VS
V SL
Figure 4.1 Internal circuit
600V/3A to 30A rating in one physical package size (mechanical layouts are identical)
Low-loss efficient IGBTs and FRDs optimized for motor drive applications
Compact and low-cost transfer mold package allows inverter design miniaturization.
High reliability due to fully tested coordination of HVIC and IGBTs.
3-phase IGBT Inverter Bridge including control ICs for gate driving and protection
- High-side: Control circuit under voltage (UV) protection (without fault signal output)
- Low-side: UV, Thermal Shut Down (TSD) and Short-Circuit (SC) protection by means of
external shunt resistor. (with fault signal output)
Single-grounded power supply and opto-coupler-less interface due to built-in HVIC
P (27)
W (26)
V (25)
U (24)
N W (23)
N V (22)
N U (21)