Main Memory Technology Direction - Micron

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Dual-Die Dual Die Stacking <strong>Technology</strong> Typical monolithic FBGA packages utilize BOC (board board-on on-chip chip) ) technology Typical dual-die dual die FBGA packages utilize COB (chip-on (chip on-board) board) technology 1.2mm thick Supports DDR3 data rates
Dual-Die Dual Die Package Construction Maximum aximum Thickness = 1.35mm RDL = Redistribution layer; center wire bond pads are redistributed to perimeter of die through a metal layer to facilitate stacking Die Die Substrate Top view of a typical RDL layer Wire Bonds
Page 2 and 3: Main Memory Technology Direction Ke
Page 4 and 5: DRAM Technology Trends
Page 6 and 7: Unit Interval (Bit-Time) (Bit Time)
Page 8 and 9: IDD DD Impact IDD vs. Technology Id
Page 10 and 11: Voltage Scaling 7 6 5 4 3 2 1 0 199
Page 12 and 13: Industry Analyst DRAM Interface For
Page 14 and 15: Computing Customer Requirements
Page 16 and 17: What Computing Customers Care About
Page 18 and 19: Microsoft’s Microsoft s Vista Sys
Page 20 and 21: Windows Vista RTM Test Results Memo
Page 22 and 23: Vista Ready Boost C&P Lab Results W
Page 26 and 27: Dual-Die Dual Die Photo Two die com
Page 28 and 29: Estimated WC power Using (1Gb) Data
Page 30 and 31: DDR2 to DDR3 Comparison Standard Fe
Page 32 and 33: DDR2 to DDR3 Comparison Standard Fe
Page 34 and 35: DDR2 to DDR3 Comparison Optional Fe
Page 36: © 2007 Microsoft Corporation. All

Main Memory Technology Direction - Micron

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