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Kelvin Contactors for Wafer-Scale Test - Semiconductor Wafer Test ...

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BGAs Present Challenges<br />

<strong>for</strong> <strong>Kelvin</strong> contact<br />

Accuracy is Critical<br />

• Leaving Mark in Ball<br />

Apex Can Negatively<br />

Affect Solderability<br />

• Landing a Probe Too<br />

Close to Edge Can<br />

Cause Ball Shear<br />

• Decreasing Pitch<br />

Exacerbates Issues<br />

Pair of misaligned probes<br />

on 0.4 mm solder ball<br />

Probe pairs on<br />

0.65 mm BGA<br />

June 7 to 10, 2009<br />

IEEE SW <strong>Test</strong> Workshop 10

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