Kelvin Contactors for Wafer-Scale Test - Semiconductor Wafer Test ...

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Issues to Overcome at Fine Pitch • Contactor Body Machining – Small, closely-spaced holes challenging: – Wall thickness – Aspect ratio – Might affect material choice Board-side tip Spacing 0.275 mm DUT-side tip Spacing 0.08 mm Fine-pitch Gemini Kelvin working height 2.45 mm June 7 to 10, 2009 IEEE SW Test Workshop 22
Issues to Overcome at Fine Pitch • Board Fabrication – Probes placed at 45° to increase pitch – Results in 0.275 mm pitch – May require space transformer Kelvin pad pairs 0.4 mm pitch Gemini Kelvin Pattern, fanned out to 0.8 mm June 7 to 10, 2009 IEEE SW Test Workshop 23
Page 1 and 2: June 7-10, 2009 San Diego, CA Kelvi
Page 3 and 4: Two Growing Test Trends Wafer-Scale
Page 5 and 6: WST a Contacting Challenge • Cont
Page 7 and 8: Kelvin: Very Useful in Final Test
Page 9 and 10: Kelvin Test at Wafer-Scale A Growin
Page 11 and 12: ECT’s Gemini Kelvin • Gemini Ke
Page 13 and 14: Example: Gemini Kelvin Contactor
Page 15 and 16: Example: Gemini Kelvin Contactor Re
Page 17 and 18: Need for Finer-Pitch Kelvin 0.5 mm
Page 19 and 20: Fine-Pitch Gemini Kelvin in Develop
Page 21: GMK030 in Wafer Scale Test June 7 t

Kelvin Contactors for Wafer-Scale Test - Semiconductor Wafer Test ...

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