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the 2009 Annual Report (pdf) - PLX Technology

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Manufacturing<br />

We have adopted a "fabless" semiconductor manufacturing model and outsource all of our semiconductor<br />

manufacturing, assembly and testing. This approach allows us to focus our resources on <strong>the</strong> design, development and<br />

marketing of products and significantly reduces our capital requirements. Currently, our products are primarily being<br />

fabricated, assembled or tested by AMD, Advanced Semiconductor Engineering, Ardentec, Faraday, Fujitsu, FST,<br />

MagnaChip, NEC, Open-Silicon, Samsung, Seiko-Epson Semiconductor, STATS ChipPAC Ltd., Taiwan<br />

Semiconductor Manufacturing Corporation, UMC and United Test and Assembly Center Ltd.. These manufacturers<br />

assemble and test our products based on <strong>the</strong> design and test specifications we have provided. A small number of our<br />

products are currently manufactured by more than one supplier, and we expect a substantial amount of our products to<br />

be single-source manufactured for <strong>the</strong> foreseeable future. We must place orders two to four months in advance of<br />

expected delivery of finished goods. We maintain inventory levels based on current lead times from foundries plus<br />

safety stock to account for unanticipated interruption in supply and fluctuations in demand. Our inventory comprises<br />

a large portion of our working capital. As a result, we have limited ability to react to fluctuations in demand for our<br />

products which could cause us to have an excess or a shortage of inventory of a particular product and reduced<br />

product revenues.<br />

In <strong>the</strong> event of a loss of, or a decision by us to change, a key supplier or foundry, qualifying a new supplier or<br />

foundry and commencing volume production would likely involve delay and expenses, resulting in lost revenues,<br />

reduced operating margins and possible detriment to customer relationships. Since we place our orders on a purchase<br />

order basis and do not have a long-term volume purchase agreement with any of our existing suppliers, any of <strong>the</strong>se<br />

suppliers may allocate capacity to <strong>the</strong> production of o<strong>the</strong>r products while reducing deliveries to us on short notice.<br />

While we believe we currently have good relationships with our foundries and adequate capacity to support our<br />

current sales levels, <strong>the</strong>re can be no assurance that adequate foundry capacity will be available in <strong>the</strong> future on<br />

acceptable terms, if at all. See "Item 1A, Risk Factors - Certain Factors That May Affect Future Operating Results -<br />

Our Independent Manufacturers May Not Be Able To Meet Our Manufacturing Requirements" in this Form 10-K.<br />

Our semiconductor devices are currently fabricated using a range of semiconductor manufacturing processes. We<br />

must continuously develop our devices using more advanced processes to remain competitive on a cost and<br />

performance basis. Migrating to new technologies is a challenging task requiring new design skills, methods and<br />

tools. We believe that <strong>the</strong> transition of our products to smaller geometries will be important for us to remain<br />

competitive. Our business could be materially adversely affected if any transition to new processes is delayed or<br />

inefficiently implemented. See " Item 1A, Risk Factors - Certain Factors That May Affect Future Operating Results -<br />

Defects in Our Products Could Increase Our Costs and Delay Our Product Shipments" in this Form 10-K.<br />

Intellectual Property<br />

Our future success and competitive position depend upon our ability to obtain and maintain <strong>the</strong> proprietary<br />

technology used in our principal products. Most of our current products include implementations of <strong>the</strong> PCI, PCI<br />

Express, Serial ATA, E<strong>the</strong>rnet, 1394 and USB industry standards, which are available to o<strong>the</strong>r companies. We hold<br />

26 patents on switching, interconnect and storage technologies that will expire at various dates beginning in 2014<br />

through 2028. In <strong>the</strong> future, we plan to seek patent protection when we believe it is necessary.<br />

Our existing or future patents may be invalidated, circumvented, challenged or licensed to o<strong>the</strong>rs. The rights<br />

granted may not provide competitive advantages to us. In addition, our future patent applications may not be issued<br />

with <strong>the</strong> scope of <strong>the</strong> claims sought by us, if at all. Fur<strong>the</strong>rmore, o<strong>the</strong>rs may develop technologies that are similar or<br />

superior to our technology, duplicate our technology or design around <strong>the</strong> patents owned or licensed by us. In<br />

addition, effective patent, trademark, copyright and trade secret protection may be unavailable or limited in foreign<br />

countries where we may need this protection. We cannot be sure that steps taken by us to protect our technology will<br />

prevent misappropriation of our technology.<br />

The semiconductor industry is characterized by vigorous protection and pursuit of intellectual property rights or<br />

positions. This often results in significant, often protracted and expensive litigation. There is no intellectual property<br />

litigation currently pending against us. However, we may from time to time receive notifications of claims that we<br />

may be infringing patents or o<strong>the</strong>r intellectual property rights owned by o<strong>the</strong>r third parties. If it is necessary or<br />

desirable, we may seek licenses under <strong>the</strong>se third party patents or intellectual property rights. However, we cannot be<br />

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