the 2009 Annual Report (pdf) - PLX Technology
the 2009 Annual Report (pdf) - PLX Technology
the 2009 Annual Report (pdf) - PLX Technology
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Manufacturing<br />
We have adopted a "fabless" semiconductor manufacturing model and outsource all of our semiconductor<br />
manufacturing, assembly and testing. This approach allows us to focus our resources on <strong>the</strong> design, development and<br />
marketing of products and significantly reduces our capital requirements. Currently, our products are primarily being<br />
fabricated, assembled or tested by AMD, Advanced Semiconductor Engineering, Ardentec, Faraday, Fujitsu, FST,<br />
MagnaChip, NEC, Open-Silicon, Samsung, Seiko-Epson Semiconductor, STATS ChipPAC Ltd., Taiwan<br />
Semiconductor Manufacturing Corporation, UMC and United Test and Assembly Center Ltd.. These manufacturers<br />
assemble and test our products based on <strong>the</strong> design and test specifications we have provided. A small number of our<br />
products are currently manufactured by more than one supplier, and we expect a substantial amount of our products to<br />
be single-source manufactured for <strong>the</strong> foreseeable future. We must place orders two to four months in advance of<br />
expected delivery of finished goods. We maintain inventory levels based on current lead times from foundries plus<br />
safety stock to account for unanticipated interruption in supply and fluctuations in demand. Our inventory comprises<br />
a large portion of our working capital. As a result, we have limited ability to react to fluctuations in demand for our<br />
products which could cause us to have an excess or a shortage of inventory of a particular product and reduced<br />
product revenues.<br />
In <strong>the</strong> event of a loss of, or a decision by us to change, a key supplier or foundry, qualifying a new supplier or<br />
foundry and commencing volume production would likely involve delay and expenses, resulting in lost revenues,<br />
reduced operating margins and possible detriment to customer relationships. Since we place our orders on a purchase<br />
order basis and do not have a long-term volume purchase agreement with any of our existing suppliers, any of <strong>the</strong>se<br />
suppliers may allocate capacity to <strong>the</strong> production of o<strong>the</strong>r products while reducing deliveries to us on short notice.<br />
While we believe we currently have good relationships with our foundries and adequate capacity to support our<br />
current sales levels, <strong>the</strong>re can be no assurance that adequate foundry capacity will be available in <strong>the</strong> future on<br />
acceptable terms, if at all. See "Item 1A, Risk Factors - Certain Factors That May Affect Future Operating Results -<br />
Our Independent Manufacturers May Not Be Able To Meet Our Manufacturing Requirements" in this Form 10-K.<br />
Our semiconductor devices are currently fabricated using a range of semiconductor manufacturing processes. We<br />
must continuously develop our devices using more advanced processes to remain competitive on a cost and<br />
performance basis. Migrating to new technologies is a challenging task requiring new design skills, methods and<br />
tools. We believe that <strong>the</strong> transition of our products to smaller geometries will be important for us to remain<br />
competitive. Our business could be materially adversely affected if any transition to new processes is delayed or<br />
inefficiently implemented. See " Item 1A, Risk Factors - Certain Factors That May Affect Future Operating Results -<br />
Defects in Our Products Could Increase Our Costs and Delay Our Product Shipments" in this Form 10-K.<br />
Intellectual Property<br />
Our future success and competitive position depend upon our ability to obtain and maintain <strong>the</strong> proprietary<br />
technology used in our principal products. Most of our current products include implementations of <strong>the</strong> PCI, PCI<br />
Express, Serial ATA, E<strong>the</strong>rnet, 1394 and USB industry standards, which are available to o<strong>the</strong>r companies. We hold<br />
26 patents on switching, interconnect and storage technologies that will expire at various dates beginning in 2014<br />
through 2028. In <strong>the</strong> future, we plan to seek patent protection when we believe it is necessary.<br />
Our existing or future patents may be invalidated, circumvented, challenged or licensed to o<strong>the</strong>rs. The rights<br />
granted may not provide competitive advantages to us. In addition, our future patent applications may not be issued<br />
with <strong>the</strong> scope of <strong>the</strong> claims sought by us, if at all. Fur<strong>the</strong>rmore, o<strong>the</strong>rs may develop technologies that are similar or<br />
superior to our technology, duplicate our technology or design around <strong>the</strong> patents owned or licensed by us. In<br />
addition, effective patent, trademark, copyright and trade secret protection may be unavailable or limited in foreign<br />
countries where we may need this protection. We cannot be sure that steps taken by us to protect our technology will<br />
prevent misappropriation of our technology.<br />
The semiconductor industry is characterized by vigorous protection and pursuit of intellectual property rights or<br />
positions. This often results in significant, often protracted and expensive litigation. There is no intellectual property<br />
litigation currently pending against us. However, we may from time to time receive notifications of claims that we<br />
may be infringing patents or o<strong>the</strong>r intellectual property rights owned by o<strong>the</strong>r third parties. If it is necessary or<br />
desirable, we may seek licenses under <strong>the</strong>se third party patents or intellectual property rights. However, we cannot be<br />
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