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Brittle Fracture of Ceramics - Semiconductor Wafer Test Workshop

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OUTLINE<br />

– Sources <strong>of</strong> ceramic fracture in the vertical probe cards<br />

– Introduction to theory <strong>of</strong> ceramic fracture<br />

– 3-point flexural strength test <strong>of</strong> ceramics<br />

– Finite element model <strong>of</strong> ceramic specimen<br />

– Ceramic stress intensity factor (SIF)<br />

– Conclusion<br />

June 7 to 10, 2009<br />

IEEE SW <strong>Test</strong> <strong>Workshop</strong> 2

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