Brittle Fracture of Ceramics - Semiconductor Wafer Test Workshop

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Test Notes and Observations - No initial cracks or preexisting large flaws on the specimens - All specimens under the load- force spontaneously and rapidly fractured without any signs of warning, some of them cracked intermittently after 3-5 minutes - No dents or plastic deformations on the ceramic surfaces have been observed in the area of contact force - Most of ceramic fractures occurred in the area of high stresses, in the middle of specimen Table 1. Mechanical Properties Properties of materials Macor Alumina Silicon Nitride Zircon Density (r) g/cm 3 2.52 3.23 3.92 4.2 Young's modulus (E) (GPa) 66.9 380 320 175 Poison's ratio () 0.29 0.24 0.28 0.4 Coefficient of Thermal Expansion June 7 to 10, 2009 x10 -6 /C 9.7 8.2 3.2 IEEE SW Test Workshop 8 4.2
Images of Fractured Specimens MACOR ALUMINA ZIRCON SILICON NITRIDE June 7 to 10, 2009 IEEE SW Test Workshop 9
Page 1 and 2: June 7-10, 2009 San Diego, CA Britt
Page 3 and 4: Ceramic Fractures in Vertical Probe
Page 5 and 6: Flexural Strength Test - Define and
Page 7: Test Description Contact Tip Size F
Page 12 and 13: Weibull Analysis The fracture stren
Page 14 and 15: FE 3-D Bending Fixture Model FE Mod
Page 16 and 17: Alumina Fractographic Observation F
Page 18 and 19: Si3N4 Fractographic Observation Fla
Page 20 and 21: Summary / Conclusions In the presen

Brittle Fracture of Ceramics - Semiconductor Wafer Test Workshop

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