power management product selection guide - International Rectifier

Dies Sales Sure Chip
| RESOURCES
The IR Advantage
• KGD testing equal to
package part testing
• 100% Avalanche capability for more
than 75A
• Singulated testing, eliminating
lateral current paths
• Accurate testing for R DS(on)
• Voltage ratings up to 1200V
• Leakage current testing down
to nA range
• Pogo pins provide accurate voltage
and resistance readings
• Hybrid modifications enable cleane
noise environment
• Each die is warranted to be
electrically good
KGD package Options
International Rectifier’s SureCHIP Program is a process regimen that combines high-volume
manufacturing and assembly with precision parametric testing and special packaging
to deliver Known Good Die (KGD) power semiconductors. The KGD process provides
measurably higher yields and is an economically viable solution in the manufacturing of
multi-chip modules (MCMs). As part of the SureCHIP process, individual good die from
probed and sawn wafers are transferred to a custom-designed test nest for 100% electrical
and visual testing.
T&R option: T&R dimensions are
according to die size.
SureCHIP power semiconductor die are packaged into tape and reel in a nitrogen
atmosphere or into chip trays for shipment. The SureCHIP KGD process is qualified for
100% DC parametric testing. Additionally, avalanche testing on MOSFETs and short circuit
testing on IGBTs can be performed.
Chip pack option:
Tray packaging option can be either
4” x 4” or 2” x 2” (outside dimensions).
www.irf.com INTERNATIONAL RECTIFIER / POWER MANAGEMENT SELECTION GUIDE 61