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SIX SIGMA<br />

benefit us all. The assembly process uses costly<br />

materials and many different kinds of tooling.<br />

What if we could consolidate tooling? What if we<br />

could cut material waste or use alternative materials<br />

to reduce cost while still meeting or exceeding<br />

quality levels? At National, our Singapore assembly<br />

and test facility did just that.<br />

In 2000, the central technology and manufacturing<br />

group (CTMG), National’s manufacturing arm<br />

at the time, began a continuous improvement initiative.<br />

After two years, CTMG senior management<br />

was still not satisfied with the improvement level.<br />

So in 2002, they invited representatives of Thomas<br />

A. Little Consulting to speak at the annual CTMG<br />

summit about their experience in high-tech disk<br />

drive processes that had a lot in common with semiconductor<br />

fabrication. They presented compelling<br />

arguments for Six Sigma when applied to the semiconductor<br />

industry’s highly process driven manufacturing<br />

methods.<br />

With fewer than 10 defective parts per million,<br />

National was satisfied with its track record and<br />

reputation but realized there’s always room for<br />

improvement. It was apparent reducing costs while<br />

maintaining product quality was a goal ripe for a<br />

Six Sigma effort.<br />

C.S. Liu, senior vice president of National’s<br />

plant in Melaka, Malaysia, at the time, agreed to<br />

conduct a nine-month Six Sigma pilot program,<br />

which showed encouraging results. In June 2003,<br />

Kamal Aggarwal, then executive vice president<br />

of CTMG, mandated all CTMG units would deploy<br />

Six Sigma. National is now on wave three of<br />

its Six Sigma deployment.<br />

Reducing Cost, Waste With DMAIC<br />

National’s Singapore plant was ideally situated<br />

for success with a material cost reduction project. It<br />

had a staff with plenty of Six Sigma experience<br />

plus access to software that could make Six Sigma<br />

projects run smoothly with less wasted time and<br />

manpower.<br />

TABLE 1<br />

Die Attach Paste Wastage Data Collection Plan<br />

Who will<br />

Define what to measure Define how to measure do it? Sample plan<br />

Measure Type of Operational Measurement Data tags needed to Data collection Persons Where? When? How<br />

measure definition or test method stratify the data method assigned many?<br />

1. Percentage Y variable Weight of Weighing Device ID, machine Manual Die attach Front of line Daily Length of<br />

waste of epoxy thrown scale number, epoxy tag, weighing operator project<br />

epoxy<br />

type, date/shift, volume<br />

thrown<br />

of syringe, time from<br />

thaw to expiry, reason<br />

of change of syringe<br />

2. Epoxy X variable Number of Epoxy shelf Epoxy type, vendor Material data Engineering Vendor specs Once Once<br />

shelf life hours to expiry life sheet<br />

after thaw<br />

3. Volume X variable Number of Number of unit Machine number, Manual Chris/Kuah Front of line Daily Every<br />

of units units produced die attach package type,lot details syringe for<br />

produced per syringe a total of<br />

per syringe<br />

80 syringes<br />

4. Epoxy X variable Amount of Usage per die Device die size,specific Data calculation Die attach Engineering Once All devices<br />

usage per epoxy use per calculations gravity engineering involved<br />

device<br />

device (die)<br />

5. Machine X variable Machine Downtime Machine number, Manual Chris/Kuah Overall Daily Every<br />

stoppages downtime downtime taken equipment syringe for<br />

efficiency<br />

80 syringes<br />

68 I<br />

DECEMBER 2005 I<br />

www.asq.org

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