Korean-American Scientists and Engineers Association

11:00am PET-6.6 Development of High Comfort Seat Foam and Its Physical Properties; Chae-Hwan
Hong, Ki-Yeon Jung, Sung-Hoon Lee, Suk-Min Choi and Yong-Jae Park; Hyundai-Kia Motors Co.
Saturday (8/16/2008) 11:30am-1:30pm Poster and Box Lunch
1:45pm
Saturday (8/16/2008) Afternoon Session: Innovative Polymer Process Development
Session Chairs: James Chung (Bayer MS) and Eung Kyu Kim (Dow Chemical)
3:00pm PET-7.1 Morphological Characterization of Novel Hybrid Resins; Shriram Bagrodia, Cereplast
and Vicki Flaris, Bronx Community College of City Univ. of New York
3:30pm PET-7.2 Fabrication of Polymer Lens by Tunable Liquid Mold; Sung Hwan Cho, Frank S. Tsai
and Yu-Hwa Lo; Univ. of California, San Diego
3:50pm PET-7.3 Photopolymerization Induced Directional Crystallization and Photopatterned Crystal
in PEO and Photo Reactive Mixture; Soo Jeoung Park; Univ. of Akron
4:10pm PET-7.4 Strengthening Of Polyolefins By Bottom-Up Self-Assembly of POSS Nanoparticles;
Byoung-Jo Lee and Sadhan C. Jana; Univ. of Akron
4:30pm PET-7.5 Ionic Liquids as New Generation Additives for Biodegradable Polylactic Acid; Ku-Il
Park and Marino Xanthos; Jersey Institute of Technology
4:30pm PET-8.1 Functionalization of Nanoclays through Exchange Reactions of Ionic Liquids for
Polypropylene Nanocomposites; Jin Uk Ha and Marino Xanthos; New Jersey Institute of
Technology
4:30pm PET-8.2 Use of Injection Speed Profile to Achieve a Uniform Void Fraction Distribution in
Injection Molded Structural Foams; John W. S. Lee, Jing Wang and Chul B. Park; Univ. of
Toronto
5:15pm
Electronic Packaging Science and
Technology (EPS)
Topics
Discussion topics for EPS sessions include materials, processes and reliabilities of electronic
packages and semiconductors
Chair
Seungbae Park (SUNY at Binghamton)
Co-Chair
Yeong J. Lee (Motorola) and
Choonheung Lee (Amkor)
Friday (8/15/2008) Morning Session: Packaging Challenges
Session Chairs: Seungbae Park (SUNY Binghamton) and Kyungwook Paik (KAIST)
8:00am EPS-1.1 Challenges and Opportunities in Electronic Packaging; Gaurang Choksi; Intel
8:45am EPS-1.2 3D Integration: Challenges and Opportunities; David Seeger; IBM
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