Korean-American Scientists and Engineers Association

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11:00am PET-6.6 Development of High Comfort Seat Foam and Its Physical Properties; Chae-Hwan Hong, Ki-Yeon Jung, Sung-Hoon Lee, Suk-Min Choi and Yong-Jae Park; Hyundai-Kia Motors Co. Saturday (8/16/2008) 11:30am-1:30pm Poster and Box Lunch 1:45pm Saturday (8/16/2008) Afternoon Session: Innovative Polymer Process Development Session Chairs: James Chung (Bayer MS) and Eung Kyu Kim (Dow Chemical) 3:00pm PET-7.1 Morphological Characterization of Novel Hybrid Resins; Shriram Bagrodia, Cereplast and Vicki Flaris, Bronx Community College of City Univ. of New York 3:30pm PET-7.2 Fabrication of Polymer Lens by Tunable Liquid Mold; Sung Hwan Cho, Frank S. Tsai and Yu-Hwa Lo; Univ. of California, San Diego 3:50pm PET-7.3 Photopolymerization Induced Directional Crystallization and Photopatterned Crystal in PEO and Photo Reactive Mixture; Soo Jeoung Park; Univ. of Akron 4:10pm PET-7.4 Strengthening Of Polyolefins By Bottom-Up Self-Assembly of POSS Nanoparticles; Byoung-Jo Lee and Sadhan C. Jana; Univ. of Akron 4:30pm PET-7.5 Ionic Liquids as New Generation Additives for Biodegradable Polylactic Acid; Ku-Il Park and Marino Xanthos; Jersey Institute of Technology 4:30pm PET-8.1 Functionalization of Nanoclays through Exchange Reactions of Ionic Liquids for Polypropylene Nanocomposites; Jin Uk Ha and Marino Xanthos; New Jersey Institute of Technology 4:30pm PET-8.2 Use of Injection Speed Profile to Achieve a Uniform Void Fraction Distribution in Injection Molded Structural Foams; John W. S. Lee, Jing Wang and Chul B. Park; Univ. of Toronto 5:15pm Electronic Packaging Science and Technology (EPS) Topics Discussion topics for EPS sessions include materials, processes and reliabilities of electronic packages and semiconductors Chair Seungbae Park (SUNY at Binghamton) Co-Chair Yeong J. Lee (Motorola) and Choonheung Lee (Amkor) Friday (8/15/2008) Morning Session: Packaging Challenges Session Chairs: Seungbae Park (SUNY Binghamton) and Kyungwook Paik (KAIST) 8:00am EPS-1.1 Challenges and Opportunities in Electronic Packaging; Gaurang Choksi; Intel 8:45am EPS-1.2 3D Integration: Challenges and Opportunities; David Seeger; IBM 52
9:30am 9:45am EPS-1.3 Recent Advances in Pb-free Solder Technology and Science; Sung-Kwon Kang; IBM 10:15am EPS-1.4 Recent Advances in Drop-Impact Reliability of Electronic Packaging Components; Yi-Shao Lai; ASE 10:45am EPS-1.5 Reliability Challenges of High Performance Game Consoles; Krishna Darbha; Microsoft 11:30am Friday (8/15/2008) Afternoon Session: Packaging Technologies Session Chairs: Sung-Kwon Kang (IBM) and Young-Ho Kim (Hanyang Univ.) 2:15pm EPS-2.1 A Novel Approach to Assess Solder Joint Reliability of Wafer-Level Fabricated Package; Jongho Lee, Youngryong Kim, Namseog Kim, Euncheol-Ahn, Taegyung Jung and Seyong Oh; Samsung 2:35pm EPS-2.2 Reliability Assessment of Lead-Free Solder Joints in Electronics Packaging; Soon- Bok Lee; KAIST 2:55pm EPS-2.3 Rapid Prototyping of Microsystems Packaging by Data-driven Chip-first Approach using Nano-Particle Silver Interconnects; Sung Chul Joo; Wayne State Univ. 3:15pm EPS-2.4 Review on Interconnect Process for TSV 3D Integrated Package; DongHee Lee, MinJae Lee, KiWook Lee, JiHee Cho, Min Yoo and JaeDong Kim; Amkor 3:45pm 4:00pm EPS-2.5 Wafer Level Packages using Anisotropic Conductive Adhesives (ACAs) and NCAs For Display, Embedded ICs, and 3-D stack Applications; Kyung-Wook Paik; KAIST 4:20pm EPS-2.6 Investigation of Moisture-induced Package Failures of Semiconductor Package Product; Hak Sung Kim and H. Thomas Hahn; UCLA 4:40pm EPS-2.7 The Highly Reliable and Fine Pitch Chip on Glass (COG) Joints Fabricated using Sn/Cu Bumps and Non-conductive Adhesives; Byeung-Gee Kim, Sang-Mok Lee and Young-Ho Kim; Hanyang Univwersity 5:00pm EPS-2.8 Effect of Silicon Carbide(SiC) as Die Attach Adhesive Filler on Thermal Performance of Semiconductor Package; Jaekyu Song*, Bongchan Kim, Kyeongsool Seong, Seokbong Kim, Yoonjoo Khim and Chanha Hwang; Amkor 5:20pm EPS-2.9 Introduction on through Mold via Technology Applied to PoP; Jinseong Kim, Dongjoo Park and Kwangho Kim; Amkor 5:45pm Saturday (8/16/2008) Packaging Materials and Science Session Chairs: Soon-Bok Lee (KAIST) and Gene Kim (Cookson Electronics) 8:00am EPS-3.1 Board Level Interfacial Mechanical Reliability of Ball Grid Array Package for Handheld Products; Soon-Wan Chung, Mi-Jin Kim, Soon-Min Hong and Young-Joon Moon; Samsung 8:20am EPS-3.2 Pattern Projection for 3D Deformation Measurement with DIC; Jae Kwak, Dong Gun Lee and SB Park; SUNY Binghamton 8:40am EPS-3.3 Characterization of Hygroscopic Properties of Advanced Polymers at High Temperatures ; Changsoo Jang, Bongtae Han and Samson Yoon; Univ. of Maryland 9:00am EPS-3.4 Free-Drop Test on Cellular Phone PCBs with Different Boundary Conditions; Dong Gun Lee, Jae Kwak, SB Park and Da Yu; SUNY Binghamton 9:30am 9:45am EPS-3.5 Comparison of Electromigration Characteristics between Flip Chip Interconnect and Pure Solder; Hyo Jeong Jeon andSB Park; SUNY Binghamton 53
Page 2 and 3: UKC2008 Plenary Speakers and Other
Page 4 and 5: Korean-American Scientists and Engi
Page 6 and 7: Advisory Committee From Korea: Prof
Page 8 and 9: Message from UKC2008 Chairs Dear KS
Page 10 and 11: UKC2008 Registration http://ukc.kse
Page 12 and 13: Distinguished Speakers at Symposium
Page 14 and 15: Food Science and Technology (FST)
Page 16 and 17: Aerospace Science and Technology (A
Page 18 and 19: Automotive Science and Technology (
Page 20 and 21: Automotive Electronics Session Chai
Page 22 and 23: Saturday (8/16/2008) Morning Sessio
Page 26 and 27: Friday (08/15/2008) Morning Session
Page 28 and 29: POS-3 Simultaneous Analytical Metho
Page 30 and 31: Drug Discovery Session Chairs: Bum-
Page 32 and 33: Saturday (8/16/2008) Afternoon Sess
Page 34 and 35: 9:20am 9:40am STA-3.5 Identifying
Page 36 and 37: 9:00am APM-3.4 Construction of Dire
Page 38 and 39: Friday (8/15/2008) Morning Session:
Page 40 and 41: Information Science and Technology
Page 44 and 45: Friday (8/15/2008) Afternoon Sessio
Page 46 and 47: NST Advisory Committee Byung-Lip Le
Page 54 and 55: 10:05am EPS-3.6 Heat Transfer Argum
Page 56 and 57: 4:35pm FST-4.3 Effects of Dietary F
Page 58 and 59: 4:00pm FST-7.2 New Trends in Resear
Page 60 and 61: POS-34 High-throughput On-chip Cell
Page 62 and 63: POS-77 The Optimization of Jelly wi
Page 64 and 65: Key Speaker (as of June 6, 2008) D
Page 66 and 67: Team Building Activities Chair Josh
Page 68 and 69: UKC2008 Sponsors Co-organizers and
Page 74: Korean-American Scientists and Engi

Korean-American Scientists and Engineers Association

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