CEL Halogen-free - California Eastern Laboratories
CEL Halogen-free - California Eastern Laboratories
CEL Halogen-free - California Eastern Laboratories
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April 6, 2009<br />
TO:<br />
SUBJECT:<br />
All <strong>CEL</strong> Customers<br />
<strong>CEL</strong> <strong>Halogen</strong>-<strong>free</strong> Transition Plan<br />
To All <strong>CEL</strong> Customers:<br />
Thank you for your continued support of <strong>CEL</strong> products.<br />
In our ongoing efforts to offer green products and remain responsive to the global trend of substance<br />
regulations, we have taken steps to meet the restricted use of <strong>Halogen</strong>s in Consumer Electronics (e.g.<br />
IEC 61249-2-21).<br />
<strong>Halogen</strong> <strong>free</strong> devices are defined as containing chlorine (Cl)
(1) Product List Change from April, 2009 Appendix 1<br />
Si-Tr、FET Si-IC GaAs-LNFET GaAs-IC<br />
Part No. Part No. Part No. Part No.<br />
2SC5369 UPB1511TB NE3503M04 UPG2008TK<br />
2SC5507 UPC2708TB NE3508M04 UPG2009TB<br />
2SC5508 UPC2709TB NE3509M04 UPG2010TB<br />
2SC5509 UPC2710TB NE3509M14 UPG2012TB<br />
2SC5751 UPC2711TB NE3510M04 UPG2012TK<br />
2SC5753 UPC2712TB UPG2015TB<br />
2SC5754 UPC2745TB UPG2030TK<br />
2SC5761 UPC2746TB UPG2041TK<br />
NE5814M14 UPC2747TB UPG2134TB<br />
NE661M05 UPC2748TB UPG2151TK<br />
NESG2021M05 UPC2749TB UPG2155TB<br />
NESG2031M05 UPC2756TB UPG2156TB<br />
NESG2101M05 UPC2757TB UPG2179TB<br />
NESG3031M05 UPC2758TB UPG2189TB<br />
NESG3031M14 UPC2762TB UPG2214TB<br />
NESG3032M14 UPC2763TB UPG2214TK<br />
NESG3033M14 UPC2771TB UPG2304TK<br />
NESG4030M14 UPC2776TB UPG2310TK<br />
UPA800T UPC3215TB UPG2406TB<br />
UPA801T UPC3223TB UPG2406TK<br />
UPA802T UPC3224TB UPG2408TB<br />
UPA804T UPC3225TB UPG2408TK<br />
UPA806T UPC3226TB UPG2409TB<br />
UPA807T<br />
UPC3227TB<br />
UPA808T<br />
UPC3232TB<br />
UPA810T<br />
UPC3236TK<br />
UPA811T<br />
UPC3237TK<br />
UPA812T<br />
UPC3239TB<br />
UPA813T<br />
UPC3240TB<br />
UPA814T<br />
UPC8106TB<br />
UPC8112TB<br />
UPC8128TB<br />
UPC8151TB<br />
UPC8163TB<br />
UPC8172TB<br />
UPC8172TK<br />
UPC8178TB<br />
UPC8178TK<br />
UPC8179TB<br />
UPC8179TK<br />
UPC8181TB<br />
UPC8182TB<br />
UPC8187TB<br />
UPC8204TK<br />
UPC8211TK<br />
UPC8226TK<br />
UPC8231TK<br />
UPC8233TK<br />
UPD5710TK<br />
UPD5713TK<br />
UPD5745TK
(2) Product List Change from July, 2009 Appendix 2<br />
Si-Tr, FET<br />
Si-IC<br />
Part No. Part No. Part No.<br />
2SC5004 UPA828TD UPB1512TU<br />
2SC5005 UPA831TD UPB1513TU<br />
2SC5006 UPA841TD UPB1514TU<br />
2SC5007 UPA851TD UPC8215TU<br />
2SC5008 UPA854TD UPC8217TU<br />
2SC5010 UPA855TD UPC8230TU<br />
2SC5011 UPA859TD UPD5702TU<br />
2SC5012<br />
UPA860TD<br />
2SC5013<br />
UPA861TD<br />
2SC5015<br />
UPA862TD<br />
2SC5180<br />
UPA863TD<br />
2SC5181<br />
UPA869TD<br />
2SC5185<br />
UPA873TC<br />
2SC5186<br />
UPA873TD<br />
2SC5195<br />
UPA891TC<br />
2SC5431<br />
UPA891TD<br />
2SC5432<br />
UPA895TD<br />
2SC5433<br />
UPA901TU<br />
2SC5435<br />
2SC5436<br />
2SC5606<br />
2SC5614<br />
2SC5615<br />
2SC5617<br />
2SC5618<br />
2SC5667<br />
2SC5668<br />
2SC5674<br />
2SC5676<br />
2SC5704<br />
2SC5746<br />
2SC5750<br />
2SC5752<br />
2SC5787<br />
2SC5800<br />
2SC5801<br />
2SC5843<br />
3SK254<br />
3SK255<br />
NE662M03<br />
NESG2021M16<br />
NESG2031M16<br />
NESG204619<br />
NESG2101M16<br />
NESG210719
To Customers<br />
GET-SB-1653<br />
The Change of Mold Resin Material<br />
to <strong>Halogen</strong> Free<br />
for Microwave Devices<br />
March, 2009<br />
NEC Electronics Corporation<br />
Compound Semiconductor Devices Division<br />
Microwave Devices Sales Engineering Group<br />
1
Introduction<br />
This is to announce that NEC Electronics will change the mold<br />
resin material of microwave devices to environment-conscious<br />
type material, “<strong>Halogen</strong> Free”, according to the schedule.<br />
This pack of slides as a pamphlet is prepared for explanation<br />
about the detail of <strong>Halogen</strong> Free products.<br />
This pamphlet will help your better understanding about the<br />
change to <strong>Halogen</strong> Free.<br />
2
Notification of Change: Mold Resin of Microwave<br />
Devices for <strong>Halogen</strong> <strong>free</strong><br />
Cf. GTP-SB-2613 dated in February 2nd, 2009<br />
1. Description of changes:<br />
1)The package mold resin is changed to non-brominated flame retardants<br />
(<strong>Halogen</strong> Free Resin).<br />
2) NEC Electronics defines “halogen <strong>free</strong>” products by which the content<br />
of chlorine (Cl) and bromine (Br) in the package mold resin.<br />
3) The substrate fills following criteria.<br />
Bromine (Br)
The Background of the change to<br />
<strong>Halogen</strong> Free<br />
Serving “green products” to protect global environment is one<br />
of NEC Electronics’ important missions.<br />
Needs for environment-conscious operation have been raised.<br />
The plastic containing Bromine and Chlorine will produce toxic<br />
Dioxin with high possibility when they burn.<br />
It is the environmental pollutant.<br />
Due to above conditions, Bromine <strong>free</strong> and Chlorine <strong>free</strong> products<br />
are required.<br />
4
The Countermeasure for <strong>Halogen</strong> Free<br />
Which material in device would be contained halogen<br />
substances *1 ?<br />
*1: Chlorine and Bromine only.<br />
Mold Resin<br />
Silver Conductive Paste<br />
Mold Resin<br />
<br />
As flame retardants, bromine (Br) or<br />
antimony (Sb) is contained<br />
approximately 3%.<br />
<br />
Change to alternative flame retardants<br />
composed with metallic hydrate<br />
components (Aluminum compound)<br />
Silver Conductive Paste<br />
High purity silver conductive paste. (No need to change)<br />
‣The packing materials (e.g. reels, cartons, etc.) are out of the halogen-<strong>free</strong> subject<br />
5
Physicality of <strong>Halogen</strong> Free Resin<br />
Br/Sb flame retardants resin<br />
(Current)<br />
Metallic hydrate retardant resin<br />
(after Change)<br />
Principle<br />
of<br />
retardant<br />
Content<br />
Br or Sb react with the volatile portion<br />
of burning source<br />
Reduce high reactive volatile portion<br />
Decomposition of metallic hydrate is<br />
endothermic react.<br />
Restrain reaction by reducing<br />
heat for burning<br />
Around 3% 10~15%<br />
Flame<br />
Retardant<br />
grade<br />
UL94 V-0 UL94 V-0<br />
Flame retardant grade will be same.<br />
Inorganic phosphorus is not used in both “current” and “change” resins.<br />
6
Mechanism of Flame Retardant (Overview)<br />
Current Resin<br />
Heat decomposition<br />
of resin<br />
Production of<br />
Flammable gas<br />
Reduce<br />
Flammable gas<br />
<strong>Halogen</strong> Free Resin<br />
Burning Cycle<br />
Reaction<br />
by Br/Sb<br />
Reduce<br />
temp. rising<br />
Temp.<br />
Rising<br />
Ignition<br />
and<br />
Burn<br />
Endothermic<br />
by Metallic Hydrate<br />
Continuous burning can be prevented<br />
by breaking the chain of burning cycle.<br />
7
Contents of Environmental Pollutants<br />
in <strong>Halogen</strong> Free Products<br />
<strong>Halogen</strong> Free<br />
Compliant<br />
RoHS Compliant<br />
Cadmium<br />
Hexavalent Chrome<br />
Mercury<br />
Lead<br />
Bromine<br />
Chlorine<br />
Cd<br />
Cr 6+<br />
Hg<br />
Pb<br />
Br<br />
Cl<br />
No Impact by Resin Change<br />
• Result of reliability test:<br />
Humidity resistance, heat resistance and thermal<br />
cycle test were performed and evaluated.<br />
No impact was observed by changing the resin.<br />
• Electric Characteristics:<br />
There is no impact on electric characteristics<br />
by changing resin.<br />
MSL (Moisture Sensitive Level: Level 1) and flame<br />
retardant level(V-0) stay the same as non <strong>Halogen</strong><br />
Free products.<br />
The details are shown in followings.<br />
9
Reliability Test Results(1)<br />
1. Evaluation of Product<br />
Item<br />
Condition<br />
High Temp.<br />
High Temp.<br />
Burn in<br />
High Temp.<br />
High Humidity<br />
Pressure<br />
Cooker Test<br />
Thermal Cycle<br />
Ta=150 ºC 1000Hrs<br />
Tj=150 ºC, Vcc or Vdd=Recommended maximum<br />
voltage, 1000Hrs<br />
Ta=85 ºC, RH=85%, Vcc or Vdd=Recommended<br />
maximum voltage, 1000Hrs<br />
Ta=125 ºC, RH=100%, 96Hrs<br />
Ta=-55 - +150 ºC, 100 Cycles<br />
Saturated moisture absorption, Infrared reflow(260 ºC peak 3times)<br />
are performed as pretreatment for each test item.<br />
No defects are observed with above tests.<br />
These tests are performed by representative packages.<br />
10
Reliability Test Results(2)<br />
2. Evaluation of Material<br />
(1) Migration Test<br />
(2) Resin Mechanical Strength Test<br />
0.42mm<br />
Copper Frame<br />
0.32mm<br />
Silver Plating<br />
0.11mm<br />
0.16mm<br />
0.15mm<br />
20V<br />
PCT Bath<br />
Ta=125 ºC<br />
Rh=100%<br />
Dendrite growth was observed<br />
on neither copper nor silver at 1000Hrs<br />
Terminal pull out strength was<br />
the same as current resin.<br />
11
Evaluation Result of Electric Characteristics<br />
S11<br />
S22<br />
Evaluation Method:<br />
Compared two resin’s RF signal<br />
characteristics at the smallest pin<br />
pitch package of NEC Electronics.<br />
(Without Die)<br />
Measurement Condition<br />
Ta=25 ºC, Pin=0dBm,<br />
f=10MHz- 8.0GHz<br />
Test Equipment<br />
Equipment Maker Type No.<br />
S21<br />
S12<br />
Network<br />
Analyzer<br />
Agilent<br />
Technology<br />
E5071B<br />
Evaluated Package<br />
UPAxxxTS<br />
(6P SLM2 non-die package)<br />
Ref<br />
Ref<br />
Eva. Board<br />
Conclusion : There is no significant difference in small<br />
signal electrical characteristics between two resins.<br />
Port 1<br />
Port 2<br />
(Top View) (mm)<br />
12
Distinction of <strong>Halogen</strong> Free Products<br />
“Y” mark is printed in S/No. column on reel and packing carton box label.<br />
It expresses <strong>Halogen</strong> Free product.<br />
This S/No. is described as “Rank” on the data sheets of Si/SiGe Transistors<br />
and Twin Transistors.<br />
(1) One and two digit mark/rank<br />
Add “Y” as the first digit.<br />
Example “K” → “YK”<br />
“FB” → “YFB”<br />
(2) Three digit mark/rank<br />
The first digit is changed into “Y”<br />
Example “R29” → “Y29”<br />
“79M” → “Y9M”<br />
Some package categories will not be printed “Y” mark in S/No. column<br />
even though they are halogen <strong>free</strong> products. These packages were originally<br />
designed without <strong>Halogen</strong>. Please see below package suffix.<br />
Total 24 packages as of 1st/Feb/2009<br />
T5F,T5J,T5K,T5L,T5M,T5N,T5R,T5S,T5T,T5X,T5Y,T5Z,<br />
T6A,T6C,T6E,T6J,T6L,T6M,T6N,T6Q,T6R,T6S,T6U,M06<br />
Example :UPG2150T5L<br />
NE3561M06<br />
13
Example of Label<br />
Label of Reel<br />
Current Label<br />
Changed<br />
Product Label<br />
14
Shipping Specification<br />
The “Rank” is described on the shipping specifications of Si/SiGe<br />
Transistors and Twin Transistors.<br />
If you need the revised shipping specifications, please request to<br />
our sales.<br />
15
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