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Photolithography Oxidation CVD PVD
Photolithography The purpose of photolithography is to imprint the desired pattern of a micro component on a substrate, normally on silicon substrates. Patterns in micro scale are produced from photo-reduction of the same pattern drawn in macro scale. Typically, the photo-reduced patterns are imprinted on masks that are commonly made of dimensionally stable transparent substrates such as quartz. The mask with micro patterns is then placed on the top of a silicon substrate, or a silicon dioxide over the silicon substrate, coated with a thin layer of photoresist. Upon exposing the photoresist to special light beams through the mask, part of the photoresist would dissolve in the subsequent development process. The remaining part of the photoresist will bear the desired patterns for the micro component. Photolithography needs to be performed in Class 10 or better clean rooms. The process is illustrated in Fig. 8.1
Page 1: Semiconductor Manufacturing Process
Page 5 and 6: Photoresists and application Positi
Page 7 and 8: Oxidation Oxidation in microelectro
Page 9 and 10: Chemical Vapor Deposition (CVD) CVD
Page 11 and 12: Chemical reactions for common thin
Page 13 and 14: Rate of CVD - Cont’d It is appare
Page 15 and 16: Enhanced CVD The rate of CVD is aff
Page 17 and 18: Comparison of various CVD processes
Page 19 and 20: Etching Etching is one of the most
Page 21 and 22: Etching
Page 23 and 24: Anisotropic etching Silicon crystal
Page 25 and 26: Etchants Etchants are the chemicals
Page 27 and 28: Selectivity ratio of etchants to si
Page 29 and 30: Etch stop - a control of wet etchin
Page 31 and 32: Plasma Etching Plasma is a neutral
Page 33 and 34: Common reactant gas chemical for pl
Page 35 and 36: Deep reactive ion etching (DRIE) fo
Page 37 and 38: Working principle of DRIE DRIE work
Page 39: Comparison of wet versus dry etchin

Etching

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