MicroProbe Vx-RF Probe Card Technology - Semiconductor Wafer ...

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Minimal Bump Damage

65µm OD

No xy-offset

5x multiple-TD

Bump imprint depth < 10µm

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AMSA Qualification Results • Excellent performance –RF-characteristics up to 6GHz –High repeatability (GrR > 98%) –Stable contact quality –Low contact resistance

Minimal Bump Damage 65µm OD No xy-offset 5x multiple-TD Bump imprint depth < 10µm

Page 1 and 2: Presenter’s Name Oliver Nagler, C
Page 3 and 4: Problem Statement • Infineon Tech
Page 5 and 6: Probes Optimized For Individual App
Page 7 and 8: Vx-RF RF-80 Contact Force Wide over
Page 9 and 10: Infineon‘s Probe Card Qualificati
Page 11 and 12: Smarti UE Critical Tests vs. 300 sa
Page 13: Smarti UE Comparison (I_TX) Package
Page 17 and 18: Cleaning • Media: ITS 1um AlO2 la

MicroProbe Vx-RF Probe Card Technology - Semiconductor Wafer ...

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