MicroProbe Vx-RF Probe Card Technology - Semiconductor Wafer ...

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MicroProbe’s s MEMs-enabled Probe Architecture Composite structure allows optimization of both mechanical and electrical properties • Technical approach – Multiple materials – Photolithographically defined • Material/geometry flexibility to provide optimal mechanical and electrical performance Probes selectively etched to highlight structure June 7 to 10, 2009 IEEE SW Test Workshop 4
Probes Optimized For Individual Applications Flat probe Cu Pillars, bumps, large pads Pointed probe Small Pads June 7 to 10, 2009 IEEE SW Test Workshop 5
Page 1 and 2: Presenter’s Name Oliver Nagler, C
Page 3: Problem Statement • Infineon Tech
Page 7 and 8: Vx-RF RF-80 Contact Force Wide over
Page 9 and 10: Infineon‘s Probe Card Qualificati
Page 11 and 12: Smarti UE Critical Tests vs. 300 sa
Page 13 and 14: Smarti UE Comparison (I_TX) Package
Page 15 and 16: Minimal Bump Damage 65µm OD No xy-
Page 17 and 18: Cleaning • Media: ITS 1um AlO2 la

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