MicroProbe Vx-RF Probe Card Technology - Semiconductor Wafer ...

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Cleaning

• Media: ITS 1um AlO2 lapping Film

• Frequency every 1/250 - 1/750 TD

• Deflection during Cleaning = 20um

• Cleaning TD's = 10

June 7 to 10, 2009

IEEE SW Test Workshop 17

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Qualification Results Bump Imprint Depth Meets Infineon‘s s bump damage requirements June 7 to 10, 2009 IEEE SW Test Workshop 16

Cleaning • Media: ITS 1um AlO2 lapping Film • Frequency every 1/250 - 1/750 TD • Deflection during Cleaning = 20um • Cleaning TD's = 10 June 7 to 10, 2009 IEEE SW Test Workshop 17

Page 1 and 2: Presenter’s Name Oliver Nagler, C
Page 3 and 4: Problem Statement • Infineon Tech
Page 5 and 6: Probes Optimized For Individual App
Page 7 and 8: Vx-RF RF-80 Contact Force Wide over
Page 9 and 10: Infineon‘s Probe Card Qualificati
Page 11 and 12: Smarti UE Critical Tests vs. 300 sa
Page 13 and 14: Smarti UE Comparison (I_TX) Package
Page 15: Minimal Bump Damage 65µm OD No xy-

MicroProbe Vx-RF Probe Card Technology - Semiconductor Wafer ...

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