Liquid Interface at Wafer Test - Semiconductor Wafer Test Workshop
Liquid Interface at Wafer Test - Semiconductor Wafer Test Workshop
Liquid Interface at Wafer Test - Semiconductor Wafer Test Workshop
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Thermal Resistance Components<br />
<strong>Wafer</strong> to chuck resistance (R0+R1) is largest contributor<br />
R0<br />
100%<br />
90%<br />
R1<br />
80%<br />
R2<br />
R3<br />
R4<br />
70%<br />
60%<br />
50%<br />
40%<br />
77.3%<br />
R0+R1<br />
R2<br />
R3+R4+R5<br />
R5<br />
R6<br />
30%<br />
20%<br />
10%<br />
0%<br />
8%<br />
14.7%<br />
R<strong>at</strong>e of thermal 1 resistance<br />
Source: Tokyo Electron<br />
15 P, Diesing 6/4/05