Liquid Interface at Wafer Test - Semiconductor Wafer Test Workshop
Liquid Interface at Wafer Test - Semiconductor Wafer Test Workshop
Liquid Interface at Wafer Test - Semiconductor Wafer Test Workshop
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Chuck top Smoothness<br />
1. Overall chuck fl<strong>at</strong>ness was 2.9um across<br />
more than 300 mm. (High quality surface)<br />
2. However, localized roughness was 1.9 um<br />
(Silicon wafer is about 0.35 um)<br />
10mm<br />
2<br />
Maximum<br />
1.5<br />
3. Conclusion: it is not practical to make<br />
sufficiently smooth m<strong>at</strong>ching surfaces<br />
(chuck to wafer)<br />
Source: Tokyo Electron<br />
1.9um<br />
1<br />
0.5<br />
0<br />
-110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110<br />
-0.5<br />
-1<br />
-1.5<br />
17 P, Diesing 6/4/05<br />
-2
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