Cu-Pillar Bump Probing: Utilizing a 50Âµm Pitch Fine Pitch Vertical ...

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Scalability Challenges • Space Transformer Availability at 50µm Pitch Array –Based on Standard Thin Film Technology Capability, Difficult to Achieve Escapement Required for Routing – Need Pad on Via at Pitch & Hence MLC/MLO not Feasible for Array Configurations at 50µm Pitch –New Type of Interconnect was Developed Internally –the Modular Space Transformer or MST TM PH MST PCB 12
Scalability Challenges • Guide Plate Wall Strength – Reduced Wall Strength due to Reduced Wall Thickness due to the Spatial Constraints at 50µm Pitch –Probes Designed to Minimize Loading on Guide Plate (FEA) – Stress/Life Tests at Max OT to Ensure Wall Integrity Guide Plate 13
Page 1 and 2: Cu‐Pillar Bump Probing: Utilizing
Page 3 and 4: Introduction • Next Generation Fl
Page 5 and 6: Testing/Probing challenges • Prob
Page 7 and 8: Prober Equipment Utilized Tester Do
Page 9 and 10: Cu‐Pillar Structure 25µm Side Vi
Page 11: PROBE CARD CHALLENGES 11
Page 15 and 16: PROBE CARD DATA 15
Page 17 and 18: Tip Alignment • Probe Tip Alignme
Page 19 and 20: Resistance on Gold • Max Total Re
Page 21 and 22: Test Method In Out 25µm 25 µm 25
Page 23 and 24: • Electrical Tests Tests in Proce

Cu-Pillar Bump Probing: Utilizing a 50Âµm Pitch Fine Pitch Vertical ...

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