Cu-Pillar Bump Probing: Utilizing a 50µm Pitch Fine Pitch Vertical ...
Cu-Pillar Bump Probing: Utilizing a 50µm Pitch Fine Pitch Vertical ...
Cu-Pillar Bump Probing: Utilizing a 50µm Pitch Fine Pitch Vertical ...
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<strong>Cu</strong>‐<strong>Pillar</strong> Structure<br />
25µm<br />
Side View<br />
Solder <strong>Bump</strong><br />
<strong>Cu</strong>‐<strong>Pillar</strong><br />
25µm<br />
Initial <strong>Bump</strong> Height : ~25 +/‐3µm<br />
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