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Cu-Pillar Bump Probing: Utilizing a 50µm Pitch Fine Pitch Vertical ...

Cu-Pillar Bump Probing: Utilizing a 50µm Pitch Fine Pitch Vertical ...

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<strong>Cu</strong>‐<strong>Pillar</strong> Structure<br />

25µm<br />

Side View<br />

Solder <strong>Bump</strong><br />

<strong>Cu</strong>‐<strong>Pillar</strong><br />

25µm<br />

Initial <strong>Bump</strong> Height : ~25 +/‐3µm<br />

9

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