Cu-Pillar Bump Probing: Utilizing a 50Âµm Pitch Fine Pitch Vertical ...

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Cu-Pillar Bump Probing: Utilizing a 50Âµm Pitch Fine Pitch Vertical ...

Cu-Pillar Bump Probing: Utilizing a 50Âµm Pitch Fine Pitch Vertical ...

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Test Method<br />

In<br />

Out<br />

25µm<br />

25 µm<br />

25µm<br />

Si<br />

Daisy Chain <strong>Bump</strong> Structure

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COPPER PILLAR BUMP PROBING 20

Test Method In Out 25µm 25 µm 25µm Si Daisy Chain <strong>Bump</strong> Structure

Page 1 and 2: Cu‐Pillar Bump Probing: Utilizing
Page 3 and 4: Introduction • Next Generation Fl
Page 5 and 6: Testing/Probing challenges • Prob
Page 7 and 8: Prober Equipment Utilized Tester Do
Page 9 and 10: Cu‐Pillar Structure 25µm Side Vi
Page 11 and 12: PROBE CARD CHALLENGES 11
Page 13 and 14: Scalability Challenges • Guide Pl
Page 15 and 16: PROBE CARD DATA 15
Page 17 and 18: Tip Alignment • Probe Tip Alignme
Page 19: Resistance on Gold • Max Total Re
Page 23 and 24: • Electrical Tests Tests in Proce