08.09.2014 Views

Cu-Pillar Bump Probing: Utilizing a 50µm Pitch Fine Pitch Vertical ...

Cu-Pillar Bump Probing: Utilizing a 50µm Pitch Fine Pitch Vertical ...

Cu-Pillar Bump Probing: Utilizing a 50µm Pitch Fine Pitch Vertical ...

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

Probe Force<br />

• Contact Force of 2.5 gf @ 50µm OT<br />

• Preferred <strong>Bump</strong> <strong>Probing</strong> OT 25 to 40µm<br />

– Minimize <strong>Bump</strong> Damage<br />

– Accommodate <strong>Bump</strong> Co‐planarity Across Wafer<br />

16

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!