An Analysis of Contact Resistance between Probe Tip and Gold Pad

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Acknowledgements

• Samsung Bump Process Engineering Team

> Yong‐Ho. Kim (Senior engineer)

• Teaching Professor in SSIT

> Jeong‐Taek. Kong (General Director)

> Hyun‐Ho. Park Ph. D.

• Will Technology Engineering Team

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Acknowledgements • Samsung Bump Process Engineering Team > Yong‐Ho. Kim (Senior engineer) • Teaching Professor in SSIT > Jeong‐Taek. Kong (General Director) > Hyun‐Ho. Park Ph. D. • Will Technology Engineering Team 23

Thank You. 24

Page 1 and 2: An Analysis of Contact Resistance b
Page 3 and 4: Key Points • Modeling of Ti Oxide
Page 5 and 6: Model of Probe Tip Contamination by
Page 7 and 8: Relationship of Fine Pitch and Resi
Page 9 and 10: Relationship of Fine Pitch and Resi
Page 11 and 12: Contact Resistance of Gold Pad B. R
Page 13 and 14: Work Function of Tip & Pad Material
Page 15 and 16: Contact Resistance Measurement of G
Page 17 and 18: Contact Resistance Measurement C. M
Page 19 and 20: Contact Resistance Measurement of G
Page 21 and 22: Comparing of Other Results Source :
Page 23: Summary • We discovered a Ti oxid

An Analysis of Contact Resistance between Probe Tip and Gold Pad

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