An Analysis of Contact Resistance between Probe Tip and Gold Pad
An Analysis of Contact Resistance between Probe Tip and Gold Pad
An Analysis of Contact Resistance between Probe Tip and Gold Pad
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Model <strong>of</strong> <strong>Probe</strong> <strong>Tip</strong> Contamination<br />
Source : Jerry J. Broz, “<strong>Probe</strong> <strong>Contact</strong> <strong>Resistance</strong><br />
Variations during Elevated Temperature Wafer Test”<br />
Test Conference,1999<br />
by Al Oxide<br />
U : Voltage drop( U = Forcing Current × Cres)<br />
T bulk : Ambient Temperature<br />
α : Temperature Coefficient <strong>of</strong> Resistivity<br />
ρ : Resistivity at the Bulk Temperature<br />
λ : Thermal Conductivity<br />
※ a‐Spot : Real Inter‐Metallic <strong>Contact</strong> Area<br />
Conducting<br />
Metal to Metal a‐Spots<br />
Localized Joule Heating<br />
in a‐Spot Area during Test<br />
Al Oxide Film growth on <strong>Pad</strong>.<br />
<strong>Probe</strong> <strong>Tip</strong> Contamination<br />
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