Manufacturing and Reliability Challenges With QFN - American ...

2 nd Level Interconnect Reliability
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IPC has attempted to rectify this through
IPC-9701
Two problems
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Adopted by OEMs; not by component manufacturers
Application specific; you have to tell them the application
(your responsibility, not theirs)
The result
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An increasing incidence of solder wearout in next generation
component packaging
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